tag: Lam Research

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Feb, 2022 - Comments: 0

Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

Transistors Reach Tipping Point At 3nm
By Mark LaPedus - 23 Feb, 2022 - Comments: 1

The semiconductor industry is making its first major change in a new transistor type in more than a decade, moving toward a next-generation structure called gate-all-around (GAA) FETs. Although GAA transistors have yet to ship, many industry experts are wondering how long this technology will deliver — and what new architecture will take over from there. Barring major delays, today’s GAA... » read more

Blog Review: Feb. 23
By Jesse Allen - 23 Feb, 2022 - Comments: 0

Synopsys' Varun Agrawal looks at four new technologies have emerged to support the demands on 5G networks and applications, the challenges in validating all of those technologies together, and what's needed to perform end-to-end testing effectively for 5G O-RAN SoCs. Siemens EDA's Ray Salemi points to how FPGA retargeting could help address supply chain difficulties and some of the challenge... » read more

Silicon-based Power Semis Face Challenges
By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

Precision Selective Etch Tools Pave The Way For The Next Technology Inflection
By Tim Archer - 17 Feb, 2022 - Comments: 0

Over the past decade, the need for increasingly smaller, denser, more powerful chips has been driving semiconductor manufacturers to move away from planar structures in favor of increasingly complex three-dimensional (3D) structures. Why? Simply put, stacking elements vertically enables greater density. Use of 3D architectures to support advanced logic and memory applications represents the ... » read more

A Sub-1 Hz Resonance Frequency Resonator Enabled By Multi-Step Tuning For Micro-Seismometer
By Coventor - 17 Feb, 2022 - Comments: 0

We propose a sub-1 Hz resonance frequency MEMS resonator that can be used for seismometers. The low resonance frequency is achieved by an electrically tunable spring with an ultra-small spring constant. Generally, it is difficult to electrically fine-tune the resonance frequency at a near-zero spring constant because the frequency shift per voltage will diverge at the limit of zero spring const... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Feb, 2022 - Comments: 0

Fab tools Lam Research has rolled out a new suite of selective etch products for use in developing next-generation technologies, such as gate-all-around (GAA) transistors. In the fab, selective etch helps chipmakers with complex structures. These etch tools provide selective and precision etching without modifying or causing damage to other critical material layers. Composed of three new... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 11 Feb, 2022 - Comments: 0

Pervasive computing, IoT and 5G Infineon added to its NFC (near-field communications) IP by acquiring NFC patent portfolios from France Brevets and Verimatrix. “With this acquisition, Infineon further strengthens its IP and technology portfolio, specifically in our leadership markets for security and connectivity for the IoT,” said Thomas Rosteck, president of Infineon’s Connected Secure... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

Blog Review: Jan. 26
By Jesse Allen - 26 Jan, 2022 - Comments: 0

Arm's Mark Inskip shares how the Morello prototype architecture, aimed at improving the security of hardware, was developed, from the creation of the prototype architecture specification, followed by the design and implementation of a new CPU, through to the development of a new SoC, hardware platform, development tools, toolchains, and software. Cadence's Paul McLellan looks at how the RISC... » read more

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