Big Changes In Embedded Software

By Ann Mutschler - 28 Apr, 2022 - Comments: 0

Every good hardware or software design starts with a structured approach throughout the design cycle, but as chip architectures and applications begin focusing on specific domains and include some version of AI, that structure is becoming more difficult to define. Embedded software, which in the past was written for very narrow functions with a minimal footprint, is increasingly getting blended... » read more

RISC-V Challenges And Opportunities

By Ed Sperling - 24 Oct, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss open instruction set hardware and the future of RISC-V with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation. (L-... » read more

Heterogeneous Hubbub

By Ann Mutschler - 08 Mar, 2018 - Comments: 0

It’s no secret that designers today would prefer not to be restricted in their architectural choices. And who can blame them? At the same time, this sentiment has boosted interest and usage of both heterogenous architectures as well as the RISC-V ISA. To support this, companies across the design, test and verification ecosystem are ramping efforts. One such effort is the teaming of UltraSo... » read more

The Week In Review: Design

By Jesse Allen - 23 Feb, 2018 - Comments: 0

Tools & IP Pro Design launched three new proFPGA Zynq UltraScale+ FPGA modules for SoC and IP prototyping. The modules combine FPGA logic with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors and on-board interfaces. The modules offer a total of up to 5 extension sites with 531 standard I/Os and 16 multi-gigabit transceivers (MGTs). The board allows a maximum point-to-point ... » read more

Better Software. Faster!

By Tom De Schutter - 27 Mar, 2014 - Comments: 0

As virtual prototyping has seen a wide adoption over the last couple of years, it felt like the right time to work with industry leaders across multiple applications and publish a book that captures the best practices in virtual prototyping. As editor of the book: Better Software. Faster!, I had the privilege to work with some incredibly knowledgeable people who have been deploying virtual prot... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.