tag: Mentor

Business, Technology Challenges Increase For Photomasks
By Mark LaPedus - 16 Dec, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Blog Review: Dec. 15
By Jesse Allen - 15 Dec, 2021 - Comments: 0

Arm's Hannah Peeler, Joshua Randall, and Zach Lasiuk examine the carbon cost of data centers and introduce a tool that allows users to make informed decisions about the carbon impact of their compute workloads. Synopsys' Kenneth Larsen provides a primer on the fundamentals of quantum computing, the role of photonics in building quantum systems, and the future potential impact on chip design.... » read more

The Return Of DAC In-Person
By Brian Bailey - 15 Dec, 2021 - Comments: 0

Apart from masked faces everywhere, you could be excused for not knowing that there was a pandemic going on. Sure, the numbers were down, the show floor was smaller, and most of the parties didn't happen, but everyone was so happy to be able to bump elbows with their colleagues. Buttons were available for attendees to show the level of comfort they had with various types of greetings, from "... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Dec, 2021 - Comments: 0

Intel intends to take Mobileye public in mid-2022 on a US market through an IPO of newly issued stock. The subsidiary, which Intel acquired in 2017, develops SoCs for ADAS and autonomous driving solutions. Mobileye has achieved record revenue year-over-year with 2021 gains expected to be more than 40 percent higher than 2020, highlighting the powerful benefits to both companies of our ongoing p... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 10 Dec, 2021 - Comments: 0

Pervasive computing An outage in network equipment at the US-EAST-1 Region of Amazon Web Services this week reminded customers of the downside to having every appliance run via a data center. Users accessing apps tied to AWS on the East coast found services did not work, including Alexa, Ring, smart appliances, some Amazon warehouses and packaging delivery, web APIs such as Slack, and some str... » read more

Amdahl Limits On AI
By Brian Bailey - 09 Dec, 2021 - Comments: 0

Software and hardware both place limits on how fast an application can run, but finding and eliminating the limitations is becoming more important in this age of multicore heterogeneous processing. The problem is certainly not new. Gene Amdahl (1922-2015) recognized the issue and published a paper about it in 1967. It provided the theoretical speedup for a defined task that could be expected... » read more

Innovations In Sensor Technology
By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Shifting Left In P&R With In-Design Signoff Fill For Faster And More Accurate Tapeouts
By Srinivas Velivala - 09 Dec, 2021 - Comments: 0

Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows to ensure designs meet their design power, performance, and area (PPA) goals while also hitting tapeout deadlines. The introduction of the Calibre RealTime Digital interface made Calibre nmDRC and Calibre nmDRC Recon design rule checking (DRC) verification available during the P&R process t... » read more

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