tag: Mentor

Multi-Patterning EUV Vs. High-NA EUV
By Mark LaPedus - 04 Dec, 2019 - Comments: 4

Foundries are finally in production with EUV lithography at 7nm, but chip customers must now decide whether to implement their next designs using EUV-based multiple patterning at 5nm/3nm or wait for a new single-patterning EUV system at 3nm and beyond. This scenario revolves around ASML’s current extreme ultraviolet (EUV) lithography tool (NXE:3400C) versus a completely new EUV system with... » read more

Blog Review: Dec. 4
By Jesse Allen - 04 Dec, 2019 - Comments: 0

Arm's Rupal Gandhi digs into the Cell-Aware Test methodology to deterministically target the growing number of defects that occur within the cells, the process of CAT library generation, and compares the static and transition patterns generated. Cadence's Paul McLellan shares highlights from the recent WOSET event with a look at the big drivers for the current interest in open-source EDA too... » read more

Achieving Functional Safety For Autonomous Vehicle SoC Designs
By Mentor, a Siemens Business - 03 Dec, 2019 - Comments: 0

Autonomous vehicle systems will be expected to meet rigorous safety standards regarding many aspects of system design and performance. One set of these standards, known as functional safety, focuses on the safety and reliability of the electrical and electronic systems within the vehicle, and the system-on-chip (SoC) devices in particular. As the complexity of these devices grows, autonomous ve... » read more

Using FPGAs For AI
By Brian Bailey - 02 Dec, 2019 - Comments: 3

Artificial intelligence (AI) and machine learning (ML) are progressing at a rate that is outstripping Moore's Law. In fact, they now are evolving faster than silicon can be designed. The industry is looking at all possibilities to provide devices that have the necessary accuracy and performance, as well as a power budget that can be sustained. FPGAs are promising, but they also have some sig... » read more

Blog Review: Nov. 27
By Jesse Allen - 27 Nov, 2019 - Comments: 0

Arm's Ben Fletcher digs into what's needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how the data can be encoded in the transceiver to reduce power consumption. Cadence's Paul McLellan listens in as Eli Singerman of Intel explains the importance of platform security and why firmware... » read more

Transforming Silicon Bring-Up
By Brian Bailey - 26 Nov, 2019 - Comments: 0

Not too long ago, the return of first silicon from the foundry was a nail-biting moment as power was applied to the chip. Today, better verification methodologies, increased use of emulation, and more mature fabrication practices have transformed how teams utilize first silicon. It is about to be transformed again, and there are some interesting possibilities on the horizon. Much of what use... » read more

Thoroughly Verifying Complex SoCs
By Ann Mutschler - 26 Nov, 2019 - Comments: 0

The number of things that can go wrong in complex SoCs targeted at leading-edge applications is staggering, and there is no indication that verifying these chips will function as expected is going to get any easier. Heterogeneous designs developed for leading-edge applications, such as 5G, IoT, automotive and AI, are now complex systems in their own right. But they also need to work in conju... » read more

A Reliable I/O Ring For A Reliable SoC
By Abdellah Bakhali - 26 Nov, 2019 - Comments: 0

What is an input/output (I/O) ring, and why should I care about it? If you’re a system-on-chip (SoC) designer, you had better know the answer to that question. SoCs are the darlings of the semiconductor industry—they combine all the typical functionality of a computer (central processing unit (CPU), memory, input/output (I/O) ports, and storage) on a single chip. They’re particularly popu... » read more

Enhancing IO Ring Checks For Consistent, Customizable Verification
By Mentor, a Siemens Business - 25 Nov, 2019 - Comments: 0

The Calibre PERC IO ring checker framework eliminates manual checking by providing a robust DRC-like environment to verify all IO placement rules with sign-off quality. Running on the first LEF/DEF floorplan, the IO ring checker provides early and full coverage of IO ring placement rules, enabling changes with minimal impact on the layout. Fast, accurate debugging and correction ensures that So... » read more

Portable Stimulus And Digital Twins
By Brian Bailey - 25 Nov, 2019 - Comments: 0

It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with  Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSp... » read more

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