tag: Mentor

Domain Expertise Becoming Essential For Analytics
By Ed Sperling - 12 Mar, 2019 - Comments: 0

Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Shedding Pounds In Automotive Electronics
By SE Staff - 12 Mar, 2019 - Comments: 2

Weight is emerging as a key concern for carmakers as more electronic circuitry is added into vehicles that are either fully or partially powered by batteries. As a result, chipmakers and OEMs are exploring alternative substrate materials, different types of sensor fusion, and new ways to reduce the number of wires. Adding pounds reduces driving range for electric or hybrid vehicles. The auto... » read more

Chip Design For The Age Of New Mobility
By Andrew Macleod - 07 Mar, 2019 - Comments: 0

In the new age of mobility, vehicles are valued more and more for their electronic features instead of mechanical specifications. As a result, companies that are able to own and optimize the design of these critical electronics will capture more of the available profit. This is bringing traditional automotive manufacturers into the electronics business, while simultaneously attracting tech comp... » read more

How To Build An Automotive Chip
By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Next Wave Of Security For IIoT
By Kevin Fogarty and Ed Sperling - 07 Mar, 2019 - Comments: 0

A rush of new products and services promise to make the famously un-secured Industrial IoT (IIoT) substantially more secure in the near future. Although the semiconductor industry has been churning out a variety of security-related products and concepts, ranging from root of trust approaches to crypto processors and physically unclonable functions, most IIoT operations have been slow to adop... » read more

ON Semiconductor Conquers Verification Challenges
By Mentor, a Siemens Business - 06 Mar, 2019 - Comments: 0

Motor controller IC design for automotive applications, such as power mirror, seats, door locks, and door lift control, creates exceptional verification challenges. Particularly because these ICs must work for over 10 years and they live in harsh environments including -40° C to 150° C temperature ranges, voltages ranging from 7V to 40V, and potential electrostatic discharge and electromagnet... » read more

The Other Side Of Makimoto’s Wave
By Ann Mutschler - 06 Mar, 2019 - Comments: 0

Custom hardware is undergoing a huge resurgence across a variety of new applications, pushing the semiconductor industry to the other side of Makimoto's Wave. Tsugio Makimoto, the technologist who identified the chip industry’s 10-year cyclical swings between standardization and customization, predicted there always will be room in ASICs for general-purpose processors. But it's becoming mo... » read more

Blog Review: Mar. 6
By Jesse Allen - 06 Mar, 2019 - Comments: 0

Synopsys' Snigdha Dua traces the evolution of memory from SDRAM to DDR5 and the techniques that provide each generation's speed increase. Cadence's Paul McLellan digs into the challenges of 112Gbps SerDes, including what makes PAM4 signaling different from NRZ and what goes into equalization and modeling. Mentor's Rich Edelman provides a quick tutorial on how to set up a custom UVM report... » read more

New Design Approaches At 7/5nm
By Ed Sperling - 04 Mar, 2019 - Comments: 0

The race to build chips with a multitude of different processing elements and memories is making it more difficult to design, verify and test these devices, particularly when AI and leading-edge manufacturing processes are involved. There are two fundamental problems. First, there are much tighter tolerances for all of the components in those designs due to proximity effects. Second, as a re... » read more

The Time Is Now For A Common Model Interface
By Ahmed Ramadan - 28 Feb, 2019 - Comments: 0

By Ahmed Ramadan and Greg Curtis Driven by consumer demand for “cheaper, faster, and better,” the semiconductor industry is continually pushing the migration to smaller process geometries. This continued scaling of complex designs into advanced process nodes is critical for applications ranging from high-performance computing to low-power mobile devices. In the past, products like sma... » read more

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