tag: multiphysics

High-Tech: Innovation At The Speed of Light
By Ansys - 12 Jan, 2022 - Comments: 0

As connectivity, digitalization, and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System-on-a-Chip. Winning demands a new design paradigm that ... » read more

Building Complex Chips That Last Longer
By Ed Sperling - 23 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

The Impact Of Multiphysics On Production Electronic Design
By Marc Swinnen - 09 Sep, 2021 - Comments: 0

For many electronic design professionals, it has become clear that the industry is transitioning through an inflection point that is shifting some of the ground rules of design. The increase in the speed and integration density in today’s systems are blurring the lines between chip design and traditional board or system design. This finds its fullest expression in multi-die, 3D integrated ... » read more

Shifting Left: Early Multi Physics Analysis For STCO
By Per Viklund - 24 Jun, 2021 - Comments: 0

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the emergence of a system technology co-optimization (STCO) approach, in which an SoC is disaggregated into smaller modules (also known as chiplets) that can be asynchronously desi... » read more

Ten Reasons 3D-IC Will Profoundly Change The Way You Design Electronics
By Marc Swinnen - 11 Mar, 2021 - Comments: 3

The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were unable to anticipate and adjust to these powerful forces of change. Consequently, I am not alone in believing that now is the time to get ready for the next significant change to your electronic desi... » read more

Learn How To Streamline Design Flows And Reduce Design Cost
By Marc Swinnen - 10 Sep, 2020 - Comments: 0

I’m excited to announce that general registration is now open for the new Ansys IDEAS Digital Forum!  IDEAS, hosted by Ansys Semiconductor, is a virtual gathering of top industry executives, thought leaders, and designers from some of the biggest IP, chip design, semiconductor foundry and electronic system companies in the world. Log in to IDEAS to join with your peers to listen to industry ... » read more

Multiphysics Reliability Signoff For Next-Generation Automotive Electronics Systems
By Ansys - 08 Jul, 2020 - Comments: 0

Automotive electronics systems depend on an ever-increasing number of electronic sensors and processing elements, which allow for 360-degree surveillance and object identification/classification. Designing and verifying these systems is, however, as complex as the systems themselves. This white paper examines how automotive chip designers can achieve the stringent safety and reliability requ... » read more

Introducing The Simulation World Virtual Conference For Multiphysics Verification
By Marc Swinnen - 22 May, 2020 - Comments: 0

The elimination of all live seminars and conferences has been felt particularly acutely by Ansys. The company’s extraordinary breadth of simulation products across many different physics – including fluidics, mechanical, optical, electrical, materials, and semiconductors – means that dozens of events for many different industrial sectors have been cancelled or postponed this year. In r... » read more

Multiphysics Simulations for AI Silicon to System Success
By Ansys - 09 Oct, 2019 - Comments: 0

Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed de... » read more

Multiphysics Challenges For EDA Tools
By Christoph Sohrmann - 10 May, 2018 - Comments: 0

Cost and performance are the main drivers for scaling of integrated circuits. However, some applications do not scale as easily as others. This is particularly true for analog circuits and everything related to high voltage and high power. Still, the demand for these kind of applications is growing rapidly due to new emerging markets such as Industry 4.0, IoT, and e-mobility. In the automoti... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy