tag: National Instruments

Complete Control Through Software
By Jeff Dorsch - 08 Aug, 2016 - Comments: 0

As Industrial Internet of Things (IIoT) applications proliferate in critical infrastructure, such as the power grid and water supply, the importance of the underlying software and the availability of an open-source platform for app development is coming to the forefront. This marks a significant shift, particularly in the industrial and commercial world, where software historically has playe... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Aug, 2016 - Comments: 0

Chipmakers The wearables market has taken another hit. Intel has issued a safety recall for a smartwatch line from its Basis Science subsidiary. "We are issuing this safety recall of the Basis Peak watch because the watch can overheat, which could result in burns or blisters on the skin surface. It is important that you stop using your watch immediately and return it. Although we are stopping ... » read more

Gaps Emerge In Test Flows
By Ed Sperling - 04 Aug, 2016 - Comments: 0

Gaps are showing up in test flows as chipmakers add more analog content and push into more safety-critical applications, exposing more points at which designs need to be tested as well as weaknesses in current tools and methodologies. The cornerstone of the [getkc id="76" kc_name="IoT"], and connected devices such as self-driving cars, is a heavy reliance on [getkc id="187" kc_name="sensors"... » read more

What’s Holding Back Analog?
By Ann Mutschler - 01 Aug, 2016 - Comments: 2

The uneasy relationship between digital and analog, coupled with tools that are either ineffective or outright ignored by the analog community, may be limiting the growth potential and technological advances in that market. That certainly doesn’t mean analog isn’t growing. In fact, analog is an increasingly critical component of ICs and the electronic devices they inhabit. The global ele... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Jul, 2016 - Comments: 0

Fab tools Lam Research’s proposed move to acquire KLA-Tencor has been pushed out for the second time. The deal was supposed to be completed by mid-2016. Then, it was pushed out to the third quarter amid regulatory issues. Now, the companies hope to close the deal by the fourth quarter of 2016. “The KLA-Tencor acquisition is expected to close in the December quarter. This reflects another p... » read more

New Drivers For Test
By Brian Bailey - 28 Jul, 2016 - Comments: 0

Mention Design for Test (DFT) and scan chains come to mind, but there is much more to it than that—and the rules of the game are changing. New application areas such as automotive may breathe new life into built-in self-test (BIST) solutions, which could also be used for manufacturing test. So could DFT as we know it be a thing of the past? Or will it continue to have a role to play? Te... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

RF Front End Testing With NI PXI
By NI - 20 Jul, 2016 - Comments: 0

What composes an RF front end in today’s radio devices? If you were to take apart your mobile phone, you would see an assortment of chips with different functions that make wireless communication possible. This white paper focuses on the duplexer, power amplifiers (PAs), and RF transceiver. To read more, click here. » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Jul, 2016 - Comments: 0

Fab and test equipment The wafer inspection market is heating up. For example, Applied Materials announced its new e-beam inspection system for use in foundry, logic, DRAM and 3D NAND applications. In addition, KLA-Tencor introduced six wafer defect inspection and review systems for leading-edge IC device manufacturing. National Instruments has rolled out a second-generation vector sig... » read more

Advanced Packaging Options, Issues
By Ed Sperling - 23 Jun, 2016 - Comments: 0

Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of this approach as an alternative to shrinking features. Cost has been one of the big deterrents for widespread adoption of [getkc id="82" kc_name="2.5D"]. Initially, the almost universal compla... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy