Monolithic CMOS Platform Integrates Piezo-Optomechanical Photonics (Mitre et al.)


Researchers from MITRE, University of Colorado Boulder, Sandia National Laboratories, University of Arizona, and MIT published a technical paper titled “Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics.” Abstract Excerpt: The paper demonstrates a “fully monolithic, all-CMOS fabricated platform” for piezo-optomechanical photonic integrated circuits and sho... » read more

AI Framework Maps Thermal Behavior In 3D Photonic Circuits (U. of Florida et al.)


Researchers from University of Florida, ficonTEC Service, and Colorado State University published a technical paper titled “AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits.” Abstract Excerpt: “Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal man... » read more

HW Fingerprinting Technique for Silicon Photonic ICs Using Photonic Crystal-based Density-Controlled Patterns (U. of Florida)


Researchers from University of Florida published a technical paper titled “Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware Fingerprinting.” Abstract Excerpt: The paper proposes a method that “embeds two-dimensional photonic crystal (PhC) patterns” and creates a “distinctive optical signature” for device authentication. Find the technical pap... » read more

Step Towards 3D PICs: Low Loss Fiber-Coupled Interconnects (UIUC)


A new technical paper titled "Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing" was published by researchers at University of Illinois Urbana-Champaign (UIUC). Abstract "Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling ... » read more

Thermal Crosstalk Modelling And Compensation Methods for Programmable Photonic ICs (TU Denmark, iPronics)


A technical paper titled “Thermal Crosstalk Modelling and Compensation Methods for Programmable Photonic Integrated Circuits” was published by researchers at the Technical University of Denmark and iPronics Programmable Photonics. Abstract: "Photonic integrated circuits play an important role in the field of optical computing, promising faster and more energy-efficient operations compared... » read more

Directly Writing and Rewriting Photonic Chips on Low-Loss Phase-Change Thin Films


A technical paper titled “Freeform direct-write and rewritable photonic integrated circuits in phase-change thin films” was published by researchers at University of Washington, University of Maryland, and Tianjin University. Abstract: "Photonic integrated circuits (PICs) with rapid prototyping and reprogramming capabilities promise revolutionary impacts on a plethora of photonic technolo... » read more

Small-Footprint Engineered Scattering Elements For Polarization Monitoring Of Photonic ICs


A technical paper titled “Engineered scattering elements used as optical test points in photonic integrated circuits” was published by researchers at University of Rochester. Abstract: "Efficient packaging of fabricated photonic integrated circuits (PICs) has been a daunting task given the breadth of applications and skill required for scalable manufacturing. One particular challenge has ... » read more

Photonics: GaSb/SiN Tunable Hybrid Integrated Laser


A new technical paper titled "Widely tunable 2 µm hybrid laser using GaSb semiconductor optical amplifiers and a Si3N4 photonics integrated reflector" was published by researchers at Tampere University in Finland. Abstract: "Tunable lasers emitting in the 2–3 µm wavelength range that are compatible with photonic integration platforms are of great interest for sensing applications. To ... » read more

Rising Fortunes For ICs In Health Care


Semiconductors are increasingly finding their way into a variety of medical devices, after years of slow growth and largely consumer electronics types of applications. Nearly every major chipmaker has a toehold in health care these days, and many are starting to look beyond wearable such as the Apple Watch to devices that can be relied on for accuracy and reliability. Unlike in the past, the... » read more

Photonic Integration Based On A Ferroelectric Thin-Film Platform


Photonic-integrated circuits (PICs) using ferroelectric materials are expected to be used in many applications because of its unique optical properties such as large electrooptic coefficients. In this study, a novel PIC based on a ferroelectric thin-film platform was designed and fabricated, where high-speed optical modulator, spot-size converters (SSCs), and a variable optical attenuator (VOA)... » read more

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