Researchers from University of Florida, ficonTEC Service, and Colorado State University published a technical paper titled “AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits.”
Abstract Excerpt: “Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs introduce critical thermal management challenges due to high-density bonding and heterogeneous materials.” The paper also presents “a dual-method solution combining an AI-driven thermal modeling framework with a design-based heuristic approach.”
Find the technical paper here. June 2026.
Biswas, Liton Kumar, Katayoon Yahyaei, Shajib Ghosh, M. Shafkat M. Khan, Himanandhan Reddy Kottur, Rayhane Ghane-Motlagh, Mahdi Nikdast, and Navid Asadizanjani. “AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits.” IMAPSource Proceedings 2025 (Symposium): 001–006, 2025. https://doi.org/10.4071/001c.147090.
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