Holistic Power Reduction


The power consumption of a device is influenced by every stage of the design, development, and implementation process, but identifying opportunities to save power no longer can be just about making hardware more efficient. Tools and methodologies are in place for most of the power-saving opportunities, from RTL down through implementation, and portions of the semiconductor industry already a... » read more

Challenges In Writing SDC Constraints


Writing design constraints is becoming more difficult as chips become more heterogeneous, and as they are expected to function longer in the field. Timing and power can change over time, and constraints need to be adjusted to that changing context. Synopsys’ Ajay Daga, group director for R&D at Synopsys, talks about the challenges in pushing constraints down to different hierarchical portions... » read more

Where Power Is Spent In HBM


HBM is gaining ground because of a spike in the amount of data that needs to be processed quickly, but big reductions in power are possible if that processing can be moved closer to the HBM modules, and if more can be done in each compute cycle without sending data back and forth to memory as frequently. Steven Woo, fellow and distinguished engineer at Rambus, talks about what can be done to bo... » read more

Improving PPA When Embedding FPGAs Into SoCs


Embedded FPGAs have been on everyone’s radar for years as a way of extending the life of chips developed at advanced nodes, but they typically have come with high performance and power overhead. That’s no longer the case, and the ability to control complex chips and keep them current with changes to algorithms and various protocols is significant step. Geoff Tate, CEO of Flex Logix, talks a... » read more

Power Issues Causing More Respins At 7nm And Below


Power consumption has been a major design consideration for some time, but it is far from being a solved issue. In fact, an increasing number of designs have a plethora of power-related problems, and those problems are getting worse in new chip designs. Many designs today are power-limited — or perhaps more accurately stated, thermal-limited. A chip only can consume as much power as it is ... » read more

Taking Power Much More Seriously


An increasing number of electronic systems are becoming limited by thermal issues, and the only way to solve them is by elevating energy consumption to a primary design concern rather than a last-minute optimization technique. The optimization of any system involves a complex balance of static and dynamic techniques. The goal is to achieve maximum functionality and performance in the smalles... » read more

A Power-First Approach


It is becoming evidently clear that heat will be the limiter for the future of semiconductors. Already, large percentages of a chip are dark at any time, because if everything operated at the same time the amount of heat generated would exceed the ability of the chip and package to dissipate that energy. If we now start to contemplate stacking dies, where the ability to extract heat remains con... » read more

Adaptive Clocking: Minding Your P-States And C-States


Larger processor arrays are here to stay for AI and cloud applications. For example, Ampere offers a 128-core behemoth for hyperscalers (mainly Oracle), while Esperanto integrates almost 10x more cores for AI workloads. However, power management becomes increasingly important with these arrays, and system designers need to balance dynamic power with system latency. As we march year over year, t... » read more

Zero Dark Silicon


Planning for AI requires an understanding of how much data needs to be processed and how quickly that needs to happen. Nick Ni, senior director of data center AI and compute markets at AMD, talks with Semiconductor Engineering about data bubbles and domain-specific designs, why dark silicon is no longer as useful as in the past, and how to optimize power and performance in both the data center ... » read more

Arm’s Input Qualification Methodology Using PowerPro


This white paper proposes a new automated input qualification methodology that Arm developed using Siemens EDA’s PowerPro software portfolio that performs various data integrity checks at the IC design build and prototype stage. This methodology ensures in quicker iterations that input data are high fidelity, leading to a well correlated power numbers. Should multiple iterations be necessary,... » read more

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