tag: process control

Interconnect Innovations In High Bandwidth Memory: Part 2
By Damon Tsai - 14 Oct, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid bonding. Both technologies are evolving to address the stringent requirements of next generation HBM in pursuit of increased I/O density supporting high... » read more

Enabling In-Line Process Control for Hybrid Bonding Applications
By Onto Innovation - 14 Oct, 2025 - Comments: 0

As demand grows for high-performance computing (HPC) and AI-driven applications, manufacturers are turning to hybrid bonding to enable the ultra-dense 3D integration required for next-generation chip architectures. This advanced packaging technology presents significant process challenges. Surface preparation must be precisely controlled to eliminate particles, excess recess, and copper pad ... » read more

End-to-End Yield Management for Compound Semiconductors Manufacturing
By PDF Solutions - 12 Aug, 2025 - Comments: 0

Abstract: Progress in compound semiconductors is hindered by the high level of defectivity of the initial material. Here we take Silicon Carbide manufacturing technology as an example and provide an overview of manufacturing analytics tools and methodologies used to drive yield ramp and capacity expansion. We focus on 2 examples of site-to-site handoff: substrates handoff to IC front-end fab or... » read more

Improving Manufacturing Yields With Process Control Solutions
By Jonathan Holt - 08 Apr, 2025 - Comments: 0

Even after 20 years or so, process control continues to be a confusing or misunderstood technology. A short description of process control is an accurate one—It’s a means of controlling manufacturing equipment and reducing variability to improve yields and performance of the products manufactured through that equipment. Tools like PDF Solutions Fault Detection and Classification (FDC)... » read more

Navigating Increased Complexity In Advanced Packaging
By Gregory Haley - 17 Dec, 2024 - Comments: 1

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line metrology to materials selection and multi-level testing. These assemblies are the result of ... » read more

Aftermarket Sensors Boost Yield In Wafer Fabs
By Anne Meixner - 10 Dec, 2024 - Comments: 0

Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs. The data gleaned from those sensors has broad uses within the fab. It can measure process module performance, identify defect sources, and alert fabs of impending equipment failure. And when coupled with machine... » read more

The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing
By Keith Best - 15 Oct, 2024 - Comments: 0

The semiconductor industry is a land of peaks and valleys. It’s a place where each innovation represents the culmination of a long and often difficult climb to the summit. In the case of glass substrates, the peak of the mountain is in sight. The arrival of glass substrates comes at an opportune time, as the industry eyes new process innovations to meet the incredible demand for high perfo... » read more

Utilizing Artificial Intelligence For Efficient Semiconductor Manufacturing
By Vivek Jain - 22 Feb, 2024 - Comments: 0

The challenges before semiconductor fabs are expansive and evolving. As the size of chips shrinks from nanometers to eventually angstroms, the complexity of the manufacturing process increases in response. It can take hundreds of process steps and more than a month to process a single wafer. It can subsequently take more than another month to go through the assembly, testing, and packaging st... » read more

Tackling Variability With AI-based Process Control
By Anne Meixner - 22 Feb, 2024 - Comments: 0

Jon Herlocker, co-founder and CEO of Tignis, sat down with Semiconductor Engineering to talk about how AI in advanced process control reduces equipment variability and corrects for process drift. What follows are excerpts of that conversation. SE: How is AI being used in semiconductor manufacturing and what will the impact be? Herlocker: AI is going to create a completely different factor... » read more

AI Process Control Platform Enabling Next Generation Technology, Part 2
By Tignis - 18 Oct, 2023 - Comments: 0

As feature dimensions in semiconductors continue to shrink and worldwide demand continues to expand, semiconductor equipment manufacturers need innovative ways to compete and deliver. The Tignis PAICe Maker physics-driven AI computational modeling platform accelerates leading-edge semiconductor manufacturing—from equipment R&D to reliable high-yield chip fabrication capability. Tignis sup... » read more

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