tag: Rambus

Blog Review: Jan. 10
By Jesse Allen - 10 Jan, 2018 - Comments: 0

Rambus' Aharon Etengoff explains the Meltdown and Spectre CPU vulnerabilities and why they could negatively affect the semiconductor industry for decades. Cadence's Paul McLellan has an explainer on Meltdown and how it's an unintended consequence of a processor behaving as intended. Mentor's Ruben Ghulghazaryan and Jeff Wilson investigate using machine learning to predict post-deposition ... » read more

Reshaping Automotive Design
By Ann Mutschler - 04 Jan, 2018 - Comments: 0

The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

Protecting Electronic Systems From Side-Channel Attacks
By Rambus - 04 Jan, 2018 - Comments: 0

During the early days of safecracking, rudimentary rotary locks were compromised by feel or sound to determine the correct combination. Following in this tradition, malicious actors are now exploiting side-channel attacks (SCA) to compromise cryptographic systems. To be sure, all physical electronic systems routinely leak information about the internal process of computing via fluctuating level... » read more

Thwarting Side-Channel Attacks With DPA-Protected Software Libraries
By Bart Stevens - 04 Jan, 2018 - Comments: 0

All physical electronic systems routinely leak information about the internal process of computing via fluctuating levels of power consumption and electro-magnetic emissions. Much like the early days of safecracking, electronic side-channel attacks (SCA) eschew a brute force approach to extracting keys and other secret information from a device or system. Moreover, SCA conducted against elec... » read more

Blockchain: Hype, Reality, Opportunities
By Susan Breidenbach - 04 Jan, 2018 - Comments: 4

Blockchain buzz has reached deafening levels, and its proponents say we haven’t heard anything yet. The blockchain-enabled transformations they describe make the Internet revolution look almost trivial. Critics argue that too many people drank the blockchain Kool-Aid. Outside the cryptocurrency arena, they say that blockchain amounts to little more than some really slick slideware. The ... » read more

Mixed-Signal Issues Worse At 10/7nm
By Ann Mutschler - 03 Jan, 2018 - Comments: 1

Despite increasingly difficulty in scaling digital logic to 10/7nm, not all designs at the leading edge are digital. In fact, there are mixed-signal components in designs at almost all nodes down to 10/7nm. This may seem surprising because analog scaling has been an issue since about 90nm, but these are not traditional analog components. Analog IP increasingly includes highly integrated, mix... » read more

Blog Review: Jan. 3
By Jesse Allen - 03 Jan, 2018 - Comments: 0

Ansys' Steve Pytel argues that increased signaling speeds and frequencies have led to signal integrity issues that circuit simulation alone cannot handle. Cadence's Paul McLellan dives into the details of Intel's 10nm process, including three layers of self-aligned quadruple patterning, contact-over-active-gate, and cobalt for contact fill. Mentor's Ron Press and Vidya Neerkundar argue th... » read more

The Week In Review: Design
By Jesse Allen - 22 Dec, 2017 - Comments: 0

Altium released the latest version of its PCB design suite. Improvements include a new interface and an upgrade to 64-bit architecture combined with multi-threaded task optimizations. Other additions include a new BoM rule checker and length tuning and pin-swapping in the user-guided routing engine. Creonic announced a new line of IP for 5G forward error correction. The product line covers t... » read more

What’s Next?
By Mike Gianfagna - 21 Dec, 2017 - Comments: 0

We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

Blog Review: Dec. 20
By Jesse Allen - 20 Dec, 2017 - Comments: 0

Mentor's Andrew Macleod points out five things that need to happen for autonomous and electric cars to move from R&D and test cases to mass-produced, commercially viable vehicles. Synopsys' Iain Singleton provides some tips on tackling large designs with formal and how the assume-guarantee technique helps split them without masking bugs. Cadence's Paul McLellan shares updates from the... » read more

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