Chip Industry Week In Review

By The SE Staff - 30 Jan, 2026 - Comments: 0

Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections. Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

Balancing Training, Quantization, And Hardware Integration In NPUs

By Ann Mutschler - 26 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML is driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down to discuss this with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Qu... » read more

Addressing Critical Tradeoffs In NPU Design

By Ann Mutschler - 21 Jan, 2026 - Comments: 1

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven W... » read more

GDDR7 Momentum Accelerates As A Key Solution For AI Inference

By Nidish Kamath - 15 Jan, 2026 - Comments: 0

The AI hardware landscape continues to evolve at a breakneck speed, and memory technology is rapidly becoming a defining differentiator for the next generation of GPUs and AI inference accelerators. When NVIDIA introduced Rubin CPX, its new class of GPU tailored for massive context inference, it underscored a new industry reality: memory throughput and efficiency are now just as critical as ra... » read more

How And Why To Optimize NPUs

By Ann Mutschler - 15 Jan, 2026 - Comments: 0

Liquid Cooling Gains Traction In Data Centers

By Bryon Moyer - 15 Jan, 2026 - Comments: 1

All electronics generate heat, and that heat must be removed to ensure those electronics don’t overheat. Moving air has been the predominant approach for decades, with liquid cooling limited to particularly intense computing workloads, largely in the supercomputing domain. With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buil... » read more

PCIe Technology in Switches

By Rambus - 14 Jan, 2026 - Comments: 0

Two benefits of using PCIe switches include accessibility to more endpoints and enabling data center disaggregation. Rambus's Lou Ternullo and Wesley Yung from Astera Labs discuss benefits, use cases, and PCIe technology used in switches in this video from PCI-SIG. Hear more about the technology here. » read more

Navigating FIPS 140-3

By Berardino Carnevale - 08 Jan, 2026 - Comments: 0

FIPS 140‑3 is a U.S. federal standard. Validations are issued under the Cryptographic Module Validation Program (CMVP), jointly managed by the National Institute of Standards (NIST) and the Canadian Center for Cyber Security (CCCS). These validations are accepted by both U.S. and Canadian federal agencies. The standard imposes strict requirements on security boundaries, operational environmen... » read more

Is End-To-End Security Possible?

By Ed Sperling - 08 Jan, 2026 - Comments: 0

Looming financial penalties for data breaches are forcing chipmakers to confront end-to-end security, an increasingly complex and daunting problem because no single company controls all the pieces anymore. This is especially apparent in multi-die assemblies, in use today in data centers, and under consideration in automotive and other applications. Multiple chiplets can push performance well... » read more

Automotive Outlook: 2026

By Ann Mutschler - 08 Jan, 2026 - Comments: 0

The automotive industry stands at a crossroads entering 2026, facing a complex interplay of global tariffs, evolving electric vehicle (EV) dynamics, and the infusion of AI into just about everything. As manufacturers and suppliers navigate recent financing shifts and regulatory changes, they also must address consumer concerns over EV affordability and range, OEM concerns over when to develo... » read more

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