tag: Si2

Energy Boost For Power Standards
By Brian Bailey - 09 Oct, 2014 - Comments: 0

If the amount of standards work and industry effort that is being expended on a given topic is any indicator of the growing importance of a design concern, then power has most certainly become the hottest topic in the industry. Thankfully, it seems as if everyone has learned their lessons from the CPF/[gettech id="31044" t_name="UPF"] struggles and is attempting to coordinate activities, while ... » read more

Why Multi-Die Integration Really Is On Its Way
By Steve Schulz - 19 Sep, 2014 - Comments: 0

Admit it. You’ve heard a lot about 3D IC’s for years now, and it’s starting to get old. Lots of talk but not much action, you say? Maybe it will never happen, you say? Well, perhaps it’s time to reassess the current situation, reevaluate emerging needs, and reset our “3D” paradigm for the coming multi-die imperative. The problems associated with 3D IC (stacked die) are real and v... » read more

Different Approaches Emerge For Stacking Die
By Ed Sperling - 21 Aug, 2014 - Comments: 1

The concept of stacking die to shorten wires, improve performance, and reduce the amount of energy required to drive signals has been in research for at least the past dozen years at both IBM and Intel. And depending upon whom you ask, it could be another 2 to 10 years before it becomes a mainstream packaging approach—if it happens at all. At least part of the confusion stems from how you ... » read more

Raising The Abstraction Of Power: Trends
By Ann Mutschler - 10 Jul, 2014 - Comments: 0

Given that design requirements for today’s SoCs go well beyond performance and area, energy efficiency and its impact on system design plays a major role for many end applications ranging from wireless sensor networks to autonomous vehicles as well as emerging applications in the Internet of Things market segment, where cooling capability is limited and expensive. For these reasons, a comp... » read more

ST Announces 20x Savings Using OpenPDK At DAC
By Steve Schulz - 02 Jul, 2014 - Comments: 0

Last month’s Design Automation Conference in San Francisco proved to be highly successful for Si2. This year, for example, Si2 organized 28 member-led presentations, issued 10 press releases, and hosted 5 special events. Today I will focus on one of those events, a special press conference featuring Philippe Magarshack, executive vice president for design enablement services at STMicroelectro... » read more

Reduced Power To The People!
By Steve Schulz - 29 May, 2014 - Comments: 0

Fifteen years ago, many of us involved in writing the design chapter of the ITRS (International Technology Roadmap for Semiconductors) already knew that power/energy consumption eventually would become a major problem for the industry’s growth. Engineers developing microprocessors (CPUs and DSPs) and graphics engines (GPUs) led the wave of predictions, because extrapolating known trend data s... » read more

Taming The PDK Beast At DAC
By Steve Schulz - 19 May, 2014 - Comments: 0

A quick Web search on the phrase “process design kit” reveals about 48 million matches. This happens to be about 10 times larger than for the current pop dance sensation “twerking,” so I guess that’s at least something to brag about. Yet if we now add the word interoperability to our PDK search, we find only 200K matches, or less than 0.5% — and therein exposes the chronic problem w... » read more

The Week In Review: Design
By Ed Sperling - 16 May, 2014 - Comments: 0

M&A Synopsys’ Coverity subsidiary bought Kalistick, a French company that makes cloud-based solutions to boost testing efficiency by allowing engineers to identify and prioritize tests. Terms of the deal were not disclosed. Tools Cadence rolled out verification IP for the new PCI Express 4.0 architecture. The new spec supports up to 16 billion transactions per second, which is double... » read more

Inside SI2’s OpenPCell Workshop
By Steve Schulz - 03 Apr, 2014 - Comments: 1

In the last Standards and Beyond blog, we provided background on the Open Process Specification, including where pcells fit into the overall picture, and gave an invitation to the OpenPCell workshop being hosted by the Silicon Integration Initiative (Si2). The ensuing workshop, held on Jan. 29, was well attended with more than 35 companies represented across the globe. It was a gathering of man... » read more

A Perspective On Open Process Specification
By Ted Paone - 27 Jan, 2014 - Comments: 2

It is the job of the Process Design Kit (PDK) engineers to deliver a high-quality PDK that properly represents the process requirements and constraints and supports the design flows used by their customers. The PDK engineer takes multiple inputs describing the process and the devices and circuitry in the process and generates the output in the form of OpenAccess technology libraries (techDB), d... » read more

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