tag: Siemens EDA

Building A More Secure SoC
By Gajinder Panesar - 05 Aug, 2021 - Comments: 1

SoC integrators know that a software-only chip security plan leaves devices open to attack. All that a hacker needs to do is find a way to replace key parts of the bootloader or the low-level firmware to compromise other software in the system used to support secure access. The most simple attacks come remotely over a network, and these can be patched with software upgrades. However, we see ... » read more

Does Your IC Security Need A Renovation?
By McKenzie Ross - 05 Aug, 2021 - Comments: 0

Five years ago, I moved from Silicon Valley to Gig Harbor, Washington and bought a fixer-upper. As part of my ongoing (and extensive) home renovations, I just finished having the entire exterior redone: roof, siding, paint, masonry, front porch, back deck, outdoor lighting, the works. If you’ve ever embarked on any kind of home remodel project, I don’t have to tell you that the process incl... » read more

The Evolving Landscape Of SoC Vulnerabilities And Analog Threats
By Siemens EDA - 04 Aug, 2021 - Comments: 0

SoC integrators know that a software-only chip security plan leaves devices open to attack. The more effective way to thwart hackers is to combat both digital and analog threats by incorporating security-focused hardware modules built into the core machine design. This paper describes sources of vulnerabilities to cyber attacks and what infrastructure is needed to secure against them. The So... » read more

Blog Review: Aug. 4
By Jesse Allen - 04 Aug, 2021 - Comments: 0

Cadence's Paul McLellan listens in as industry luminaries celebrate 50 years of the microprocessor with a discussion on major challenges to the growth of microprocessors, inflection points over the last 50 years, and predictions for the next 25. Siemens EDA's Vladimir Kirichenko warns that designing electrical and thermal systems separately may lead to various problems such as late design ch... » read more

Designing Chips In A ‘Lawless’ Industry
By Ed Sperling - 02 Aug, 2021 - Comments: 2

The guideposts for designing chips are disappearing or becoming less relevant. While engineers today have many more options for customizing a design, they have little direction about what works best for specific applications or what the return on investment will be for those efforts. For chip architects, this is proving to be an embarrassment of riches. However, that design freedom comes wit... » read more

Robust Variation-Aware Smart Power Designs For Silicon Success
By Nebabie Kebebew - 29 Jul, 2021 - Comments: 0

Power management ICs (PMICs) is a rapidly growing segment in the semiconductor industry. The growth has been fueled by the demand for Smart Power applications that include wearable electronics, mobile computing platforms, printers, hard disk drives (HDD), IoT devices, and the full array of automotive applications. According to a report from market research firm Coherent Market Insights, the gl... » read more

Challenges For New AI Processor Architectures
By Brian Bailey - 29 Jul, 2021 - Comments: 0

Investment money is flooding into the development of new AI processors for the data center, but the problems here are unique, the results are unpredictable, and the competition has deep pockets and very sticky products. The biggest issue may be insufficient data about the end market. When designing a new AI processor, every design team has to answer one fundamental question — how much flex... » read more

Continuous Education For Engineers
By Brian Bailey - 29 Jul, 2021 - Comments: 0

Continuous education is essential for engineers, but many companies don't recognize the value or they are unwilling to provide the necessary resources. This should be a line of questioning before every new hire makes the decision about where they want to work, because it not only affects their future career, but also impacts the value they can provide to that company during the course of the... » read more

Tape Out On Time With Demand Signoff DRC In P&R
By Siemens EDA - 28 Jul, 2021 - Comments: 0

Physical characteristics of devices have become progressively more complex even as design companies pack more devices on each die. Combining these characteristics with ever more demanding chip power, performance, and area (PPA) goals not only result in increased resource utilization but also challenge existing tools/flows/techniques. Adding on-demand signoff-quality DRC verification inside P&R ... » read more

Blog Review: July 28
By Jesse Allen - 28 Jul, 2021 - Comments: 0

Synopsys' Chris Clark considers potential vulnerabilities in automotive over-the-air updates and best practices and new standards the industry can implement to improve security of vehicle software updates. Cadence's Paul McLellan gets a look at expected new fab construction in the coming years and where capacity is being focused. Siemens' Robin Bornoff dives into electromagnetic simulatio... » read more

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