tag: Siemens EDA

7nm Fab Challenges
By Mark LaPedus - 21 Apr, 2016 - Comments: 3

Leading-edge foundry vendors have made the challenging transition from traditional planar processes into the finFET transistor era. The first [getkc id="185" kc_name="finFETs"] were based on the 22nm node, and now the industry is ramping up 16nm/14nm technologies. Going forward, the question is how far the finFET can be scaled. In fact, 10nm finFETs from Samsung are expected to ramp by ye... » read more

ECOs and Multi-Patterning: It Can Be Done
By David Abercrombie - 21 Apr, 2016 - Comments: 0

By David Abercrombie and Alex Pearson A lot has been written and discussed about how to decompose (color) layouts for advanced process nodes that require multi­patterning (MP). However, one topic that has been sorely ignored is how to efficiently make changes to designs that are already colored, or even taped out and processed. We tend to act like all designs work out the first time through... » read more

Calibre xACT Parasitic Extraction Supports Signal Integrity At Advanced Nodes
By Mentor, a Siemens Business - 21 Apr, 2016 - Comments: 0

At advanced nodes, signal integrity analysis requires precise characterization, which in turn requires an accurate extracted netlist. Models that handle new impacts on parasitic extraction at advanced nodes, including multi-patterning, finFETs, and resistance and capacitance effects, must be used. Learn how the Calibre xACT extraction tool supports these advanced foundry device models and leadi... » read more

Blog Review: April 20
By Jesse Allen - 20 Apr, 2016 - Comments: 0

Synopsys' Michael Posner digs into the relationships between USB Type-C, USB 3.1, Power Delivery and DisplayPort specifications. Cadence's Paul McLellan listens in on a discussion of the memory market's growth in China, and what's on the horizon. Mentor's Andy Macleod looks at the challenges that come with the increased car customization consumers are demanding. An energy-harvesting, t... » read more

Rightsizing Challenges Grow
By Ed Sperling - 20 Apr, 2016 - Comments: 0

Rightsizing chip architectures is getting much more complicated. There are more options to choose from, more potential bottlenecks, and many more choices about what process to use at what process node and for which markets and price points. Rightsizing is a way of targeting chips to specific application needs, supplying sufficient performance while minimizing power and cost. It has been a to... » read more

The Week In Review: Design/IoT
By Jesse Allen - 15 Apr, 2016 - Comments: 0

Mergers & Acquisitions Cadence acquired [getentity id="22444" comment="Rocketick"], an Israel-based company focused on multicore parallel simulation. Founded in 2008, their original rise and claim to fame was acceleration on GPUs, having received significant funding from Nvidia. The deal is expected to close in the second quarter of fiscal 2016, and terms were not disclosed. Tools &am... » read more

Power Management Heats Up
By Brian Bailey - 14 Apr, 2016 - Comments: 0

Power management has been talked about a lot recently, especially when it comes to mobile devices. But power is only a part of the issue—and perhaps not even the most important part. Heat is the ultimate limiter. If you cannot comfortably place the device on your face or wrist, then you will not have a successful product. Controlling heat, at the micro and macro levels, is an important asp... » read more

Analyzing The Integrity Of Power
By Ann Mutschler - 14 Apr, 2016 - Comments: 0

Power analysis is shifting much earlier in the chip design process, with power emerging as the top design constraint at advanced process nodes. As engineering teams pack more functionality and content into bigger and more complex chips, they are having to deal with more complex interactions that affect everything from power to its impact on signal integrity and long-term reliability. That, i... » read more

An Introduction To Reducing Dynamic Power
By Ellie Burns - 14 Apr, 2016 - Comments: 0

In the past few blogs we have been primarily talking about UPF and applying the Successive Refinement process to save power. But, this process addresses leakage power. In this session we want to talk about how to save dynamic power. As designs move to finFET technology, dynamic power is the dominant contributor to power consumption. Power consumption trend. I recently sat down with my c... » read more

The Need For Speed: Strategies For Design Efficiency
By Mentor, a Siemens Business - 13 Apr, 2016 - Comments: 0

Years of experience with one EDA tool obviously develops efficiency and makes you accustomed to the intricacies (good and bad) of your PCB design tool. However, with the development pace of today's technology, there comes a time when you need to consider a change to incorporate the latest methodologies. Reprinted with permission from The PCB Design Magazine, this article looks at productivity i... » read more

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