Security Tradeoffs: A Difficult Balance


Experts At The Table: Semiconductor Engineering sat down to discuss hardware security challenges, including new threat models from AI-based attacks, with Nicole Fern, principal security analyst at Keysight; Serge Leef, AI-For-Silicon strategist at Microsoft; Scott Best, senior director for silicon security products at Rambus; Lee Harrison, director of Tessent Automotive IC Solutions at Sieme... » read more

Blog Review: Aug. 6


Cadence's Shyam Sharma checks out key features of the LPDDR6 specification, including data transfer speeds that can reach up to 14.4Gbps, two sub-channels per device, metadata built into the data packets, and row hammer mitigation. Synopsys' Frank Malloy and Vincent van der Leest describe the essential role that a hardware root of trust plays in providing a secure foundation for all other se... » read more

Hallucination And Innovation At DAC


At DAC this year, I had the pleasure of moderating an intimate chat between Alon Shtepel, senior director for ASIC at Micron, and Abhi Kolpekwar, vice president and general manager for digital verification technology at Siemens EDA. The assigned topic was generative AI in design and verification, with the more provocative subtitle asking if we are hallucinating or innovating? L-R: Brian ... » read more

Baby, It’s Hot Outside!


Electronics manufacturing production sites are ideal places to be during the summer because they maintain controlled temperatures. It’s well known that 23°C (74°F) is the ideal temperature inside electronics manufacturing areas. However, when the outside temperature reaches 40°C (104°F), the air conditioning system may struggle to maintain this lower value indoors. Many companies estab... » read more

Multi-Modal AI In EDA Development Flows


RTL coding is a critical step in the development of semiconductors, but many would argue it is not the most difficult. Things become a lot more complex as you get closer to implementation, and as the system context becomes larger than can be comprehended by text alone. In both cases, layout, timing, power, and many other factors come into play, but none is as easily represented by text, and the... » read more

How AI Will Impact Chip Design And Designers


Experts at the Table: Semiconductor Engineering sat down to discuss the role and impact of AI in chip design with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at Synopsys; Sailesh Kumar, CEO of Baya Systems; Mehir Arora, head of engineering... » read more

Blog Review: July 30


Siemens' John McMillan compares 2.5D and 3D-IC technologies and why choosing between them depends on the specific requirements of a product, such as power consumption, thermal constraints, form factor limitations, data bandwidth, and performance-per-watt targets. Cadence's Yeshavanth BN checks out changes in MIPI MPHY 6.0 that increase the data rate and improve the performance of next-genera... » read more

Changes In Scan Test Data


Bigger designs with hundred of cores are creating an explosion in the volume of scan test data, significantly bumping up the amount of time spent on test. That raises the cost of test, forcing chipmakers to trade off higher costs with reliability. The solution is to raise the level of abstraction for scan tests, using a bus and packetized data that can run at much higher frequencies than is pos... » read more

CMOS 2.0: Layered Logic For The Post-Nanosheet Era


The semiconductor industry has relied on a simple equation for more than five decades — shrink the transistor, pack more onto every wafer, and watch performance soar as costs plummet. While each new node delivered predictable gains in speed, power efficiency, and density, that formula is rapidly running out of steam. As transistors approach single-digit nanometer processes, manufacturing c... » read more

Blog Review: July 23


Synopsys' Vincent van der Leest and Mike Borza argue that hardware security is critical for providing the foundational trust, physical protection, and performance enhancements necessary to support software security and prevent leaks of sensitive data and cryptographic keys. Siemens' Shetha Nolke explains why stress matters so much in 3D-ICs and why evaluating it isn't as straightforward as i... » read more

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