tag: Siemens EDA

Launching The Full Potential Of 3D IC With Front-End Architectural Planning
By Siemens EDA - 19 Aug, 2025 - Comments: 0

3D IC and chiplet-based design have the potential to accelerate the pace of semiconductor industry innovation. 3D IC design teams pack more functionality closer together and achieve higher levels of systems integration and performance in a smaller footprint faster than what’s possible with traditional SoC implementation. To achieve the full potential of 3D IC, teams need cost-effective fro... » read more

Complex Mix Of Processors At The Edge
By Liz Allan - 18 Aug, 2025 - Comments: 1

With AI changing so fast, it’s a juggle for companies to ensure they can deliver the best performance now while also future-proofing for unknown AI models or a completely different approach to training and inference that may emerge. There are a slew of options for high-end and budget phones, hyperscalers, and low-cost, low-power edge devices, and while GPUs keep making headlines, many designe... » read more

Moving Past “It Works” — Intelligent Optimization Is the Key to PCB Excellence
By Shivani Joshi - 14 Aug, 2025 - Comments: 0

In the fast-evolving field of electronic systems design, engineers are under increasing pressure to deliver innovative, high-performance products within ever-shrinking development cycles. Traditional methods—relying on intuition, trial-and-error testing, and even basic simulation—struggle to keep pace with the growing complexity of modern systems. Nowhere is this more evident than in printe... » read more

Reliable Training Data Paramount To AI Model Success
By Ann Mutschler - 14 Aug, 2025 - Comments: 0

AI systems are increasingly being integrated into safety- and mission-critical applications ranging from automotive to health care and industrial IoT, stepping up the need for training data that is reliable, secure, and which is generated from trusted sources. AI activity is growing exponentially, as everybody tries to figure out how to apply it to their domain, application, or workload. In ... » read more

Chiplet Interfaces Embrace Failures
By Anne Meixner - 12 Aug, 2025 - Comments: 0

Redundancy in chiplet interfaces is now a prerequisite for achieving sufficient yield in high-performance computing devices, which today are packed with tens of thousands of interconnects. And as the number and density of those interconnects increases, the prospects for yield only worsen. For more than two decades, high-speed I/O interfaces have included reliability strategies to manage in-f... » read more

New Error Correcting Code And Non-Volatile Memory Options For Memory BIST
By Etienne Racine - 12 Aug, 2025 - Comments: 0

Tessent MemoryBIST from Siemens EDA provides a complete solution for at-speed test, diagnosis, repair, debug and characterization of embedded memories. Leveraging a flexible hierarchical architecture, built-in self-test (BIST) and self-repair can be integrated at both the individual core level and the top level. Tessent MemoryBIST efficiently addresses the ever-increasing demand for testing ... » read more

FuSa Flow For Achieving An ASIL-C Safety Architecture
By Siemens EDA - 07 Aug, 2025 - Comments: 0

ISO 26262, titled “Road vehicles – Functional safety,” is an international standard for the functional safety of electrical and electronic systems in road vehicles. First published in 2011 and revised in 2018, ISO 26262 adapts the broader IEC 61508 standard for automotive applications. The ISO 26262 standard underscores the importance of achieving specific random hardware failure rate tar... » read more

Agentic AI: Lots Of Little Black Boxes
By Ed Sperling - 07 Aug, 2025 - Comments: 0

AI is changing so quickly that it's not always clear how much of a security threat it poses for semiconductor design, and that uncertainty increases as AI agents are introduced into the mix. So far, the use of AI in chip design has been highly targeted. Most of what is included in design tools is some version of machine learning, bounded by tight control loops. EDA and IP vendors, large chip... » read more

Achieving An ASIL-C Safety Architecture
By Ann Keffer - 07 Aug, 2025 - Comments: 0

By Ann Keffer, Jyothy Melaedavattil Jaganathan, and Arun Gogineni The ISO 26262 standard offers a structured framework for managing functional safety across the entire development lifecycle of automotive electronic systems—from specification and design to implementation, integration, verification, validation, and production release. It emphasizes the importance of meeting specific random h... » read more

SDVs And AI Forcing Big Changes In Automotive
By Ann Mutschler - 07 Aug, 2025 - Comments: 0

The automotive industry is undergoing a fundamental transformation that includes everything from software-defined vehicles, the injection of AI into nearly every facet of the design and use case of a vehicle, and a complete overhaul of traditional relationships between different tiers and OEMs. The switch to software-defined vehicles is a top priority for the automotive ecosystem. It enables... » read more

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