tag: Siemens EDA

Fill Challenge Solved: Why SmartFill is as Good as it Sounds
By Jean-Marie Brunet - 12 Jan, 2012 - Comments: 0

by Jean-Marie Brunet Among the many steps involved with chip design, there is one known by the deceptively simple name of “fill.” Fill involves adding shapes or polygons to the design that are structural, not logical. That is, they ensure manufacturability by making sure each layer (metal, poly, diffusion) has a proscribed density. As easy as this sounds, fill can be tricky, and the fill... » read more

Undervolting & Underclocking
By Barry Pangrle - 12 Jan, 2012 - Comments: 0

By Barry Pangrle Last month we looked at record-breaking clock frequencies accompanied by voltage levels over 2V for some high-speed x86 processors. This month we’re going to go in the opposite direction—reducing the voltage and clock frequency to reduce power. Our processor of choice is the AMD A8-3850, a 100W, 2.9 GHz, quad-core, x86 processor that also incorporates 400 “Radeon core... » read more

Experts At The Table: Making Software More Energy-Efficient
By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ed Sperling Low-Power Engineering sat down to discuss software and power with Adam Kaiser, Nucleus RTOS architect at Mentor Graphics; Pete Hardee, marketing director at Cadence; Chris Rowen, CTO of Tensilica; Vic Kulkarni, senior vice president and general manager of Apache Design, and Bill Neifert, CTO of Carbon Design Systems. What follows are excerpts of that conversation. LPE: Softw... » read more

Making Software Better
By Ed Sperling - 11 Jan, 2012 - Comments: 0

Low-Power Engineering talks about what will make software more energy-efficient with Pete Hardee, marketing director at Cadence; Adam Kaiser, Nucleus RTOS architect at Mentor Graphics; Chris Rowen, CTO of Tensilica; Vic Kulkarni, senior VP and General Manager of Apache Design, and Bill Neifert, CTO of Carbon Design. [youtube vid=Jxquj8K8_BA] » read more

Rebalancing Power, Performance And Area
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ed Sperling The tradeoffs between performance, power and area are being fine-tuned to a degree never seen before in the IC business, driven partly by complexity, partly by better tools, and partly by the need to gain a competitive edge in specific applications. Just being able to make these kinds of tradeoffs is a technological feat that marries everything from high-level modeling and sy... » read more

Too Many Standards, But Still Not Enough
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ed Sperling The semiconductor industry has been one of the most prolific sectors in history when it comes to generating standards. Talk to any design engineer facing time-to-market pressures, new packaging approaches, and a mindboggling number of merchant IP, subsystems and interface requirements, and you’ll hear a compelling pitch for new standards. Talk to his or her boss and you’ll p... » read more

Model-Driven Design: Making Progress
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ann Steffora Mutschler Model-driven design is coming into its own, in part because the old way of using models at advanced nodes doesn’t always produce usable chips and in part because of the need for making tradeoffs at the earliest stages of the design process. The concept of developing models for IC design is hardly a new one, and it is being done today on a number of levels rangin... » read more

What To Expect In 2012
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ann Steffora Mutschler Looking at the biggest challenges for system-level design in 2012, model availability, IP integration and hardware/software co-design top everyone’s list. The integration of IP and enabling that from a system-level perspective is a significant challenge for the industry. Moreover, it will become even more significant as the market moves further down the Moore’s... » read more

AT vs. LT
By Jon McDonald - 15 Dec, 2011 - Comments: 0

By Jon McDonald A subject came up today that has come up on numerous occasions: “How often will the transaction-level model with timing, AT, be used versus the functional model, LT?” This is a common question; the answer is often very specific to the user. The kinds of questions and the analysis required will drive the level of accuracy required in the models. It’s probably easiest... » read more

After The Ball Drops
By Atrenta - 14 Dec, 2011 - Comments: 0

Growing up in New York City leaves lasting memories. The coming holiday season evokes some strong ones. The Christmas tree in Rockefeller Center is an example. Christmas always seemed to radiate in all directions from that huge tree perched above the ice skating rink behind Radio City Music Hall. And then there was the ball dropping on New Year’s Eve in Times Square. For the most part, New Yo... » read more

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