Supply Chain Adjusts To Design At The System Level


By Ann Steffora Mutschler System-level design is impacting the supply chain at many levels. Software suppliers, IP providers, semiconductor companies, system integrators and OEMs are challenged to work ever more closely together and find a new balance of power for who controls what in the content of an SoC. “We see more and more the design chain driving how our tools work together,” Fra... » read more

System-Level Technology Conversations Shift To Deployment


While much has been achieved to define a system-level design flow, more is still needed. Technology goals vary depending on the perspective of tool providers in terms of what needs to be done to realize the promise of a streamlined tool flow from TLM 2.0 down to GDS II. To many, 2011 will be an interesting year in the system-level design space as conversations with customers have shifted. �... » read more

Why Is My Simulation So Slow?


By Jon McDonald I am amazed how often simulation performance comes up when discussing SystemC and transaction-level modeling. Some of this I can understand. If you are new to transaction-level modeling the implications can take a while to get a handle on. Fundamentally it is difficult to justify the investment in TLM if the models are not significantly simpler to write and significantly fas... » read more

The Rising Stake In Software Tools


By Ed Sperling The growing importance of software and off-the-shelf IP in semiconductor design is beginning to change the dynamics of the entire EDA tools business, setting off a string of acquisitions as the largest players realign themselves to take advantage of this shift. The most recent example: Mentor Graphics’ acquisition this week of CodeSourcery, a GNU-based Linux toolchain and s... » read more

Power On


By Barry Pangrle Process development is more challenging at each successive technology node but the march forward, for the time being, continues unabated. Voltage scaling stopped around the 100nm node at roughly 1.0v as threshold voltages stopped shrinking in an attempt to keep leakage in check. It’s been the progression to the newer and smaller technology nodes that has really pushed power ... » read more

The Deafening Problem Of High-Speed I/O


By Ann Steffora Mutschler The performance of digital systems today is limited by the interconnection bandwidth between chips, boards, and cabinets. This has driven I/O speeds up into the gigabytes. While this boosts performance, it also opens the door to a host of new problems within the chip, board and system. Add low-power requirements to the mix and it is a recipe for huge headaches. One... » read more

3D Stacked Die Create Unique Test Issues


By Ann Steffora Mutschler While 3D die stacking promises a number of benefits including smaller footprint, faster speed, lower power and possibly lower cost, testing those devices isn’t going to be simple. There are varying degrees of challenges aligned with varying types of defects that occur throughout the process, from wafer fabrication to package assembly to system-level assembly. And... » read more

Building Up In 3D


By Ed Sperling Stacked die are expected to begin showing up in volume in late 2012 and in 2013, turning what has been a science experiment into a mainstream way of designing and manufacturing SoCs. This magnitude of this shift cannot be overstated, and clearly all of the pieces are not in place to make it all happen immediately. There also are significant technology challenges to overcome, ... » read more

Verifying At The System Level


By Ed Sperling Verification has always been the problem child of SoC design. It requires the most engineering resources, the largest block of time and the biggest budget in the design process. And at each new process node the problem gets bigger, in part because there is more stuff on each die—transistors, memory, interconnects, I/O, functionality—and in part because chipmakers are being c... » read more

Out Of Context


By Jon McDonald A rose by any other name is still a rose. I have had the opportunity to speak with a number of different groups recently, covering everyone from systems engineers focused on specifications and documentation to software teams, architects and implementation groups. Each group has their own unique language, their own unique way of communication. Some of the most entertaining co... » read more

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