tag: silicon photonics

Making Chips At 3nm And Beyond
By Mark LaPedus and Ed Sperling - 16 Apr, 2020 - Comments: 4

Select foundries are beginning to ramp up their new 5nm processes with 3nm in R&D. The big question is what comes after that. Work is well underway for the 2nm node and beyond, but there are numerous challenges as well as some uncertainty on the horizon. There already are signs that the foundries have pushed out their 3nm production schedules by a few months due to various technical issu... » read more

Startup Funding: March 2020
By Jesse Allen - 08 Apr, 2020 - Comments: 0

Dedicated AI hardware, quantum computing, and avionics startups shined in March. Here's a look at seventeen startups, which raised a collective $525M. The avionics sector soared thanks to Lilium and its electric vertical takeoff jet. Quantum computing was another hot area, with three companies bringing in ~$88M together. Plus, chip design management, two companies developing AR glasses, and how... » read more

Physical Verification For Photonics Integrated Circuits
By Manoz Palaparthi - 26 Mar, 2020 - Comments: 0

Silicon photonics is a promising solution for the explosive growth of data volume and network traffic in computing and communications. Silicon photonics integrates photonics applications on a silicon wafer, utilizing mainstream Si-based technology. Photonics integrated circuits (PIC) offer several advantages over traditional integrated circuits: faster data transfer speeds, lower power consumpt... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Mar, 2020 - Comments: 0

Market research The coronavirus is having a major impact on the semiconductor, smartphone and related markets. For example, global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year, according to a report from SEMI. But the coronavirus (COVID-19) outbreak has eroded fab equipment spending in China and elsewhere in 2020, according to the rep... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 13 Mar, 2020 - Comments: 0

AI, machine learning Cadence says it has optimized its Tensilica HiFi digital signal processor IP to efficiently execute TensorFlow Lite for Microcontrollers, which are used in Google’s machine learning platform for edge. This means developers of AI/ML on the edge systems can now put better audio processing on edge devices with ML applications like keyword detection, audio scene detection, n... » read more

Brighter Future For Photonics
By Brian Bailey - 13 Feb, 2020 - Comments: 3

Photons increasingly are taking over where electrons are failing in communications, but mixing the two never has been easy. There always have been two potential implementation paths — building each on its own substrate and then stacking them, or building them on a single substrate. The tradeoff between the two solutions is more complex than it may initially appear, and ongoing improvements... » read more

Making Light More Reliable
By Ed Sperling - 11 Feb, 2020 - Comments: 0

The buzz around photonics in packages and between packages is growing. Now the question is whether it will work as expected, and where it will be useful. Replacing electrical with optical signals has been on the technology horizon for some time. Light moves faster through fiber than electrons through copper. How much faster depends upon the diameter of the wires, the substrate and interconne... » read more

Big Design, IP and End Market Shifts In 2020
By Brian Bailey - 30 Jan, 2020 - Comments: 0

EDA is on a roll. Design starts are up significantly thanks to increased investment in areas such as AI, a plethora of new communications standards, buildout of the Cloud, the race toward autonomous driving and continued advancements in mobile phones. Many designs demand the latest technologies and push the limits of complexity. Low power is becoming more than just reducing wasted power at t... » read more

Die-To-Die Connectivity
By Ed Sperling - 22 Nov, 2019 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

Power/Performance Bits: Nov. 19
By Jesse Allen - 19 Nov, 2019 - Comments: 0

Quantum communications chip Researchers at Nanyang Technological University, Australian National University, A∗STAR, University of Science and Technology of China, Singapore University of Technology and Design, Sun Yat-sen University, Beijing University of Posts and Telecommunications, and National University of Singapore built an integrated silicon photonic chip capable of performing quantu... » read more

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