tag: simulations

ANN Framework for Thermal-Aware Modeling of GAAFETs (NYCU)
By Technical Paper Link - 12 May, 2026 - Comments: 0

A new technical paper, "A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs," was published by researchers at National Yang Ming Chiao Tung University. Abstract "This work introduces a device-physics-informed neural network framework for simultaneous modeling of thermal-aware I-V and C-V characteristics of gate-all-around (GAA) f... » read more

The Race Begins For Much Bigger Abstractions In Data Centers
By Ed Sperling - 17 Feb, 2026 - Comments: 0

Key Takeaways Data center build-out is enabling much larger and more complex abstractions. Competition is building for digital/virtual twins across multiple industry segments, including automotive, aerospace, and chip manufacturing. AI, and particularly AI agents, will play a significant role in sorting through data to find potential trouble spots. The frenzy of new data cen... » read more

Designing for 448G: Modulation, DSP, and Channel Trade-offs in High-Speed SerDes
By Synopsys - 10 Dec, 2025 - Comments: 0

Discover practical solutions and engineering insights for deploying 448G SerDes in AI and HPC cluster networks. In this white paper, you’ll learn: The impact of retimed vs. unretimed host architectures on signal integrity and power Key trade-offs between PAM4 and PAM6 modulation Channel design simulations and DSP implications using real-world 448G topologies Equalization stra... » read more

Simulating Atomic Layer Processing Of 2D Materials
By Synopsys - 18 Sep, 2025 - Comments: 0

Integrating 2D materials into sustainable electronic devices presents key challenges, particularly in depositing or etching nanometer-thick layers on high aspect ratio structures. Atomic Layer Etching (ALE) offers atomic-level precision and has demonstrated success in producing atomically thin layers of transition metal dichalcogenides (TMDs) like MoS2. Synopsys has developed an industry-grade ... » read more

Streamlining Functional Verification For Multi-Die And Chiplet Designs
By Cadence - 30 Jul, 2025 - Comments: 0

An Opportunity and a Challenge The manufacturing aspects of multi-die/multi-chiplet designs are often highlighted, but what about verification? Functional correctness and performance of inter-die connections via a standard interface, such as UCIe or a custom inter-die interface, are not guaranteed to meet all system requirements. These interfaces must be verified comprehensively, ensuring co... » read more

Photonic-Electronic SmartNIC With Fast and Energy-Efficient Photonic Computing Cores (MIT)
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “Lightning: A Reconfigurable Photonic-Electronic SmartNIC for Fast and Energy-Efficient Inference” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: "The massive growth of machine learning-based applications and the end of Moore's law have created a pressing need to redesign computing platforms. We propose Lightning, the first ... » read more

Customization, Heterogenous Integration, And Brute Force Verification
By Ed Sperling - 14 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss why new approaches are required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group at Synopsys; John Lee, general manager and vice president of the Ansys Semiconductor business unit; Michael Jackson, corporate vice president for R&D at Cadence; Prashant Varshney, head of product for Microsoft Azu... » read more

Improving Emergency Response in the Era of ADAS Vehicles in the Smart City
By Technical Paper Link - 24 Mar, 2022 - Comments: 0

Abstract: "Management of emergency vehicles can be fostered within a Smart City, i.e. an urban environment in which many IoT devices are orchestrated by a distributed intelligence able to suggest to road users the best course of action in different traffic situations. By extending MATSim (Multi-Agent Transport Simulation Software), we design and test appropriate mitigation strategies when tr... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations
By Ansys - 13 Aug, 2021 - Comments: 0

Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

Comprehensive Simulation Of Power Electronics Systems
By Synopsys - 09 Nov, 2020 - Comments: 0

Power electronics systems are at the heart of many important and growing industries, from all-electric vehicles to renewable energy generation. Optimizing the design of these systems requires accurate modeling and simulation long before construction of physical prototypes. SPICE-level simulation has been the traditional solution and, while it still plays a key role, it cannot satisfy all requir... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy