tag: Synopsys

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process
By Guy Cortez - 16 Apr, 2021 - Comments: 0

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Blog Review: April 14
By Jesse Allen - 14 Apr, 2021 - Comments: 0

Siemens EDA's Jake Wiltgen provides an overview of setting up an executing a fault injection campaign to prove that the IC or IP will safely operate under a faulted state caused by a random hardware failure, required to meet higher ASIL targets for ISO 26262 functional safety certification. Synopsys' Taylor Armerding considers the state of medical device security and the growing attack surfa... » read more

Requirements For Exhaustive SoC Reset Domain Crossing Checks
By Joe Mallett - 13 Apr, 2021 - Comments: 0

It is common to read that the numbers of clock domains and power domains in system-on-chip (SoC) designs are increasing, but for some reason there is less discussion about resets. There is no doubt that the number of reset domains is also rising; studies have shown that the single reset of twenty years ago has been replaced by a complex network of 40-50 domains in many chips and even 150 in som... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Apr, 2021 - Comments: 0

Tools & IP Cadence debuted the Palladium Z2 Enterprise Emulation and Protium X2 Enterprise Prototyping systems. The Palladium Z2 is based on a new custom emulation processor, while the Protium X2 is based on Xilinx UltraScale+ VU19P FPGAs. Designed to work together with a common front-end flow, they provide 2X capacity and 1.5X performance improvements over the previous generations, and ne... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 09 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back LG Electronics says it is closing its mobile business unit to focus on growth areas such as electric vehicle components, connected devices, smart homes, robotics, artificial intelligence and business-to-business solutions, as well as platforms and services. The company will continue to update some premium phones after it leaves th... » read more

Interconnects In A Domain-Specific World
By Brian Bailey - 08 Apr, 2021 - Comments: 0

Moving data around is probably the least interesting aspect of system design, but it is one of three legs that defines the key performance indicators (KPI) for a system. Computation, memory, and interconnect all need to be balanced. Otherwise, resources are wasted and performance is lost. The problem is that the interconnect is rarely seen as a contributor to system functionality. It is seen... » read more

Meeting Fundamental Interface Requirements For Camera And Display With Integrated MIPI IP
By Licinio Sousa - 08 Apr, 2021 - Comments: 0

Cameras and displays are used in cars, industrial and medical devices, smartphones and other mobile devices, and machine vision applications. Over the years, the required data for high resolution videos and images have increased, forcing camera and display SoCs to process more complex visual data. The MIPI Alliance offers a portfolio of camera and display interfaces that deliver differentiation... » read more

More Data Drives Focus On IC Energy Efficiency
By Ann Mutschler - 08 Apr, 2021 - Comments: 0

Computing workloads are becoming increasingly interdependent, raising the complexity level for chip architects as they work out exactly where that computing should be done and how to optimize it for shrinking energy margins. At a fundamental level, there is now more data to compute and more urgency in getting results. This situation has forced a rethinking of how much data should be moved, w... » read more

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