Chip Industry Week In Review

By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Probing UPF Dynamic Objects

By Mentor, a Siemens Business - 11 Nov, 2020 - Comments: 0

This paper presents a new low-power verification methodology that makes it possible to continuously monitor the dynamic properties of UPF objects and utilize the information to develop custom low-power verification environments. Based on UPF information model concepts, it allows querying of any dynamic properties of UPF objects through a Tcl API and passing object information on to appropriatel... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Oct, 2018 - Comments: 1

Chipmakers Fujitsu, once a major manufacturer of ICs, continues to move away from chip production. On Semiconductor has completed the incremental 20% share purchase of Aizu Fujitsu Semiconductor Manufacturing, Fujitsu’s 200mm wafer fab in Aizu-Wakamatsu. On Semi will now hold a 60% majority ownership in the fab joint venture. Consequently, the name of the venture will transition to On Semico... » read more

For SoC ISO 26262 Compliance, Should All EDA Tools Be TCL1?

By Mary Ann White - 02 Nov, 2017 - Comments: 2

ISO 26262, the automotive functional safety standard, requires the assessment of software tool confidence levels (TCLs) as either a TCL1, TCL2 or TCL3. Part 8:2011, clause 11.4.5 of the ISO 26262 standard provides a methodology with guidance for software tool classification and qualification. It applies to software tools used for the development of safety-critical designs where it is essentia... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 29 Jan, 2016 - Comments: 0

Qualcomm recently announced the new Snapdragon 820. The cell-phone chipset is based on Samsung Electronics’ new 14nm LPP (Low-Power Plus) process, the second-generation of the company’s 14nm finFET process technology. What’s next? Qualcomm is developing the Snapdragon 830. “Snapdragon 830 leaks indicate that the chip will sport 8GB of RAM, an enhanced Kryo custom architecture, and fabbe... » read more

Package Modeling Needs For A Robust IC Power Integrity Sign-Off

By Chris Ortiz - 12 Mar, 2015 - Comments: 0

Progress in IC technology has allowed chip designers to pack more functionality and continually make better use of silicon area. This trend, coupled with the need to maintain low power using techniques such as voltage islands and power and clock gating, has caused the power consumption to vary across the chip and over time. This has introduced considerable amount of transient current peaks in t... » read more

tag: tcl

Chip Industry Week In Review

Startup Funding: December 2022

Probing UPF Dynamic Objects

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

For SoC ISO 26262 Compliance, Should All EDA Tools Be TCL1?

The Week In Review: Manufacturing

Package Modeling Needs For A Robust IC Power Integrity Sign-Off

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