A Test Generation Procedure Targeting Subcircuits With High Susceptibilities To Aging (Purdue University)


A technical paper titled "Test Generation for Subcircuits with High Functional Switching Activities" was published by Irith Pomeranz at Purdue University. Abstract "Chip aging results in defects that are initially likely to appear as delay faults. The susceptibility of a delay fault to aging can be assessed based on the layout or the functional workload at the fault site. The key contribu... » read more

Aging Aware Steepening Metric for the Fault Coverage of a Test Set (Purdue Univ.)


A new technical paper titled "Aging Aware Steepening of the Fault Coverage Curve of a Scan Based Transition Fault Test Set" was published by researchers at Purdue University. Abstract "Chip aging may result in hardware defects whose likelihood of occurrence depends on the layout and functional workload at the defect site. In-field testing is important for the detection of defects that occur... » read more

Pinpointing Timing Delays Can Improve Chip Reliability


Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and for chip telemetry circuits that can assess timing margin over a chip's lifetime. Knowing the timing margin in signal paths has become an essential component in that reliability. Timing relationships a... » read more