Chip Industry Technical Paper Roundup: June 16


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Eidola: Modeling Multi-GPU Network Communication Traffic in Distributed AI Workloads 🔗 University of Wisconsin-Madison, AMD Beyond Silicon: Materials, Mechanisms, and Methods for Physical Neural Computing 🔗 University of Lübeck, TU Hamburg InjectV: M... » read more

Physical Neural Networks: A Survey (U. of Lübeck, TU Hamburg)


Researchers from the University of Lübeck and TU Hamburg published a technical paper titled “Beyond Silicon: Materials, Mechanisms, and Methods for Physical Neural Computing.” Abstract: “Physical implementations of neural computation now extend far beyond silicon hardware, encompassing substrates such as memristive devices, photonic circuits, mechanical metamaterials, microfluidic netwo... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

SystemC-based Power Side-Channel Attacks Against AI Accelerators (Univ. of Lubeck)


A new technical paper titled "SystemC Model of Power Side-Channel Attacks Against AI Accelerators: Superstition or not?" was published by researchers at Germany's University of Lubeck. Abstract "As training artificial intelligence (AI) models is a lengthy and hence costly process, leakage of such a model's internal parameters is highly undesirable. In the case of AI accelerators, side-chann... » read more