tag: University of Notre Dame

Cryogenic CMOS Becomes Cool
By Brian Bailey - 11 Aug, 2022 - Comments: 1

Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Week In Review, Manufacturing, Test
By Karen Heyman - 05 Aug, 2022 - Comments: 1

Post-CHIPS Act Micron is discussing a potential new fab that could employ thousands of workers, following the passage of the Chips and Science Act. Idaho is hoping it will be built near its headquarters facilities in Boise, but Micron hasn’t committed publicly. Rob Beard, senior vice president, general counsel and corporate secretary at Micron, told the Idaho Statesman the company is consi... » read more

Technical Paper Round-up: May 31
By Linda Christensen - 31 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=30 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Neuromorphic HW Fabric That Supports A Recently Proposed Class of Stochastic Neural Network
By Technical Paper Link - 25 May, 2022 - Comments: 0

New research paper titled "Neural sampling machine with stochastic synapse allows brain-like learning and inference" from University of Notre Dame and Department of Cognitive Sciences, University of California Irvine. Abstract "Many real-world mission-critical applications require continual online learning from noisy data and real-time decision making with a defined confidence level. Brain-... » read more

Power/Performance Bits: Feb. 15
By Jesse Allen - 15 Feb, 2022 - Comments: 0

3D printed piezoelectrics Researchers at University of Notre Dame and Purdue University developed a hybrid 3D printer that combines multi-material aerosol jet printing and extrusion printing, integrating both functional and structural materials into a single printing platform. They used it to create an all-printed piezoelectric wearable device. The stretchable piezoelectric sensors conform ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Ed Sperling - 22 Oct, 2021 - Comments: 0

An investigation by the Automobile Association of America found that lane-keeping assist and automatic emergency braking, both high-profile ADAS features, are prone to failure in rain. According to the report, 69% of tests conducted with simulated rainfall resulted in test vehicles crossing lane markers, and 33% of simulations resulted in collisions at 35 mph. Surprisingly, risk of accidents di... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Oct, 2021 - Comments: 0

Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

FeFETs Bring Promise And Challenges
By Bryon Moyer - 17 Feb, 2021 - Comments: 3

Ferroelectric FETs (FeFETs) and memory (FeRAM) are generating high levels of interest in the research community. Based on a physical mechanism that hasn’t yet been commercially exploited, they join the other interesting new physics ideas that are in various stages of commercialization. “FeRAM is very promising, but it's like all promising memory technologies — it takes a while to get b... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

What’s the Right Path For Scaling?
By Mark LaPedus - 02 Jan, 2019 - Comments: 1

The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the industry laying plans for 5nm and beyond. But less conventional approaches are becoming more viable and gaining traction, as well, including advanced packaging and in-memory computing. Some option... » read more

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