Test Anything, Anywhere, Anytime

The semiconductor industry is under relentless pressure to deliver devices that are not only high-performing but also exceptionally reliable across their entire lifecycle. From the moment a chip is tested at the wafer to its deployment in complex systems such as data centers and automotive platforms, the expectation is clear: zero-defect quality at shipment and continuous reliability in the field. Achieving this dual mandate has become increasingly challenging as process nodes shrink, system complexity grows, and usage environments become more demanding.

At the start of the lifecycle, semiconductor devices must be defect-free at wafer and package test. This stage is critical because any escaped defect can propagate downstream, increasing costs and potentially impacting end-customer systems. However, ensuring initial quality is no longer sufficient. Devices must also maintain their integrity throughout their operational lifespan. In-field testing is therefore essential to quickly detect emerging defects, whether caused by silicon aging, environmental conditions, or unexpected stress, especially in mission-critical applications such as hyperscale data centers and automotive systems where uptime and safety are paramount.

Addressing both requirements, manufacturing quality and in-field reliability, demands a comprehensive, scalable, and flexible test approach. This is where Tessent In-System Test comes into play, enabling the industry to meet these challenges head-on with a unified strategy. With its powerful capabilities and broad applicability, Tessent In-System Test truly delivers on its promise: “Test anything, anywhere, anytime.”

Enabling zero-defect manufacturing with HSIO-based test delivery

A key advancement in Tessent In-System Test is its support for high-speed I/O (HSIO) interfaces such as PCIe and USB for test data delivery. This capability fundamentally transforms how test patterns are delivered during manufacturing. Instead of relying solely on traditional test interfaces such as general-purpose IO (GPIO), HSIO enables high-bandwidth, flexible, and scalable test access across all stages of manufacturing, including wafer test, package test, and system-level test.

By leveraging HSIO throughout the manufacturing flow, semiconductor companies can achieve significantly higher test coverage and efficiency. This approach supports the industry’s drive downward toward 0 DPPM (defective parts per million) outgoing quality, ensuring that only the highest-quality devices are shipped to customers. Moreover, the ability to reuse the same test infrastructure across multiple stages simplifies implementation and reduces overall test cost, while improving consistency and coverage.

System-Level Test (SLT), traditionally isolated from earlier test stages, also benefits from this integration. With Tessent In-System Test, SLT can utilize the same deterministic test patterns and delivery mechanisms, enhancing defect detection capabilities and bridging the gap between structural test and real-world system validation. Furthermore, the same infrastructure can be reused to deliver more advanced fault models and test pattern volume that traditionally doesn’t fit into memory of Automatic Test Equipment (ATE) memory.

Extending test into the field

Beyond manufacturing, Tessent In-System Test extends its value into the operational phase of semiconductor devices. Using Embedded Deterministic Test (EDT) patterns, it enables efficient and targeted in-field testing to detect latent defects that may arise during device operation. These could include issues related to silicon aging, voltage fluctuations, thermal stress, or workload-induced degradation.

In environments such as data centers or automotive systems, where reliability is critical, the ability to periodically test devices in the field is essential for ensuring system integrity and availability. Tessent In-System Test provides the mechanism to perform these checks with minimal disruption, allowing early detection of failures and enabling proactive maintenance.

Additionally, Tessent In-System Test supports power-on and power-off testing, ensuring devices are verified during critical operational transitions. These moments are often overlooked but can expose vulnerabilities that are not detected during standard runtime conditions. By incorporating test coverage at these stages, the solution further enhances overall device reliability and robustness.

Advanced fault models for deep defect detection

Across all use cases—manufacturing test, system-level test, and in-field validation—Tessent In-System Test supports advanced fault models that go beyond traditional stuck-at testing. These models are essential for identifying increasingly complex defects in modern semiconductor devices.

Advanced fault models include:

• Timing-aware testing to detect path delays and setup/hold violations
• Stress testing to evaluate device behavior under extreme conditions
• Small delay defect detection to capture subtle timing issues that could lead to system failures
• Detection of silent data errors, which are particularly critical in high-reliability environments like AI workloads and automotive safety systems

By incorporating these sophisticated fault models, Tessent In-System Test ensures comprehensive defect coverage, helping to identify issues that might otherwise go unnoticed until they cause system-level failures.

A unified approach to lifecycle quality

In today’s semiconductor landscape, quality cannot be a point solution—it must span the entire device lifecycle. Tessent In-System Test provides a unified framework that seamlessly connects manufacturing test and in-field validation, enabling continuous quality assurance from silicon birth to end-of-life.

With its ability to leverage HSIO for scalable test delivery, support advanced fault models, and enable in-field test execution, Tessent In-System Test empowers semiconductor companies to:

• Achieve defect-free manufacturing quality
• Ensure continuous reliability in the field
• Reduce test cost and complexity
• Improve time-to-market and system uptime

Ultimately, it fulfills the industry’s growing need for a comprehensive, flexible, and future-ready test solution.

As semiconductor devices become more complex and their applications more critical, the need for robust, end-to-end test strategies has never been greater. Tessent In-System Test rises to this challenge by delivering a holistic solution that ensures quality at every stage of the device lifecycle.

From enabling 0 DPPM manufacturing quality through HSIO-based test delivery to providing in-field testing capabilities that detect failures before they impact systems, it offers unmatched versatility and depth.