The fab is almost always better off financially if it can find and fix the defect inline instead of at the end of line.
Defect inspection tools can be expensive. But regardless of the cost of the inspection tool needed to find a defect, the fab is almost always better off financially if it can find and fix that defect inline versus at the end of line (e.g., electrical test and failure analysis). Here, we are referring to the term defect in a general sense—the same concepts also apply to metrology measurements.
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The more compute power, the better. But what’s the best way to get there?
Yield rises with mask protection; multiple sources will likely reduce costs.
More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.
CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.
Computational storage approaches push power and latency tradeoffs.
Gate-all-around FETs will replace finFETs, but the transition will be costly and difficult.
An upbeat industry at the start of the year met one of its biggest challenges, but instead of being a headwind, it quickly turned into a tailwind.
The backbone of computing architecture for 75 years is being supplanted by more efficient, less general compute architectures.
How long a chip is supposed to function raises questions design teams need to think about, including how much they trust aging models.
New interconnects and processes will be required to reach the next process nodes.
After failing in the fab race, the country has started focusing on less capital-intensive segments.
Servers today feature one or two x86 chips, or maybe an Arm processor. In 5 or 10 years they will feature many more.
SRC’s new CEO sheds some light on next-gen projects involving everything from chiplets to hyperdimensional computing and mixed reality.
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