With millions of TGVs on a panel, the ability to analyze a large quantity of inspection and metrology data within a short time period is crucial.
The drive for increased performance is enticing some advanced packaging manufacturers to transition from traditional organic substrates to glass core substrates, a switch that comes with numerous benefits. Compared to organic substrates, glass core offers superior mechanical strength, is better suited for large package sizes, provides improved electrical properties, and has the ability to meet new line/space requirements of 1.5µm and below in support of the dense interconnects for advanced logic nodes and high-performance packages.
Glass substrates, however, are not immediately poised to push aside organic substrates as the preferred material for advanced packaging substrates. Thanks to a host of innovations, organic substrates will remain viable for advanced packages. Regardless, many manufacturers are developing glass substrates now instead of waiting for organic substrates to reach their line/space endpoints.
To optimize this transition from organic to glass substrate, interconnect technologies are changing as well.
Through glass vias (TGVs) are the critical vertical electrical connections that pass through a glass substrate.
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Fig.1: TGV CD distribution and analysis heat map. Source: Onto Innovation.
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