Blog Review: Sept. 17

Siemens’ John McMillan explores the fundamentals of IC package thermal resistance, modeling strategies, and why die-level thermal analysis in 3D-ICs is increasingly essential for ensuring device reliability.

Cadence’s Jasmine Makhija provides an overview of the TEE Device Interface Security Protocol (TDISP), which helps safeguard PCIe devices within Trusted Execution Environments by providing a structured framework that addresses key security concerns from device authentication and secure communication to interface management and access control.

Synopsys’ Walter Wottreng considers how the automotive value chain is shifting in response to the increasingly prominent role that software and advanced silicon have in supporting the ADAS and in-vehicle infotainment functions of modern vehicles.

Arm’s Lizzie Salter explores the challenges of sign language translation and introduces a project aimed at using machine learning on mobile devices to translate spoken speech into visual signs.

Ansys’ Caty Fairclough presents a guide on how to implement the DO-178C standard for developing safety-critical software in the aviation industry by using simulation software and model-based design to support design, verification, and code generation, including formal properties definitions and formal verification.

Keysight’s Carrie Browen defines the basic characteristics of software-defined vehicles and the advantages of a layered, zonal architecture that decouples software from hardware.

SEMI’s Heidi Hoffman and Saifi Usmani highlight finalists in this year’s SEMI Startups for Sustainable Semiconductors program, which includes startups developing manufacturing and inspection equipment, high-speed data center interconnects, and thermal management approaches.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Power architect Barry Pangrle finds the focus at Hot Chips has shifted from sockets to total system performance.

Rambus’ Raj Uppala focuses on finding the right mix of memory performance, efficiency, and form factor flexibility.

Fraunhofer IIS/EAS’ Benjamin Prautsch discusses overall system optimization across different fields of expertise, abstraction levels or hierarchies, and domains of KPI measures.

Siemens EDA’s Ujjwal Negi and Prashant Dixit argue that higher data rates, runtime recalibration, priority messaging, and advanced transport features in UCIe 3.0 boost performance but add verification complexity.

Cadence’s Vanessa Do highlights why PCIe switches are the invisible foundation that ensures modern high-performance computing systems operate with speed and precision.

Arm’s Liam O’Neil breaks down AI-powered upscaling for mobile gaming.

Ansys’ Jennifer Procario and Peter Slättman show how digital engineering is impacting manufacturing in nearly every industry, from construction and transportation to automotive and aerospace.