category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Novel Assist Layers To Enhance EUV Lithography Performance Of Photoresists On Different Substrates
By Brewer Science - 16 Aug, 2023 - Comments: 0

In EUV lithography, good resist patterning requires an assist layer beneath it to provide adhesion to prevent pattern collapse of small features and allow for higher aspect ratios. In addition, future EUV high numerical aperture (NA) is expected to require a decrease in thickness from the overall patterning stack. In this study, we are exploring a fundamentally new approach to developing an alt... » read more

AI Process Control Platform Enabling Next Generation Technology
By Tignis - 16 Aug, 2023 - Comments: 0

PAICe Monitor delivers AI and machine learning-enabled analytics for all stages of the semiconductor fabrication process lifecycle — from process development and ramp readiness, to high volume production. Leveraging Tignis’ Digital Twin Query Language, PAICe Monitor enables process engineers to transform in-product fault diagnoses into continuous real-time monitoring—greatly improving ... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process
By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 11 Aug, 2023 - Comments: 0

TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Week In Review: Semiconductor Manufacturing, Test
By SE Staff - 04 Aug, 2023 - Comments: 0

China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must obtain a license from China’s Ministry of Commerce. China produces 60% of the worldwide supply of germanium and 80% of the world’s gallium, both of which have to be processed from other mate... » read more

Battling Over Shrinking Physical Margin In Chips
By Ed Sperling - 31 Jul, 2023 - Comments: 0

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 28 Jul, 2023 - Comments: 0

The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April 2022, Chinese authorities began revamping their national standards to include a new requirement that key components, such as semiconductors and laser-related items, be designed, developed, and pro... » read more

High-NA Lithography Starting To Take Shape
By Gregory Haley - 25 Jul, 2023 - Comments: 3

The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes despite an almost perpetual barrage of highly challenging technological issues. For years, lithography was viewed as the primary manufacturing-related gating factor to continued device scaling, beset by multiple delays th... » read more

Using ML For Improved Fab Scheduling
By Katherine Derbyshire - 25 Jul, 2023 - Comments: 0

Expanding fab capacity is slow and expensive even under ideal circumstances. It has been still more difficult in recent years, as pandemic-related shortages have strained equipment supply chains. When integrated circuit demand rises faster than expansions can fill the gap, fabs try to find “hidden” capacity through improved operations. They hope that more efficient workflows will allow e... » read more

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