category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Over-The-Air (OTA) Test Socket And Handler Integration Technology For 5G Mass Production Testing
By Advantest - 11 Jan, 2022 - Comments: 0

This paper presents the integration of socket, measurement antenna and handler for over-the-air (OTA) testing of antenna-in-package (AiP) devices using automated test equipment (ATE) for 5G applications. The design and characteristics of sockets for performing OTA testing in the radiating near field are also discussed. The paper also describes the structure of OTA handler integration using thes... » read more

Inspecting And Testing GaN Power Semis
By Patrick Waurzyniak - 11 Jan, 2022 - Comments: 1

As demand for new automotive battery electric vehicles (BEVs) heats up, automakers are looking for solutions to meet strict zero-defect goals in power semiconductors. Gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap power semiconductors offer automakers a range of new EV solutions, but questions remain on how to meet the stringent quality goals of the automotive industry. Among t... » read more

Extreme Ancestry: Silicon Edition
By Mike McIntyre - 11 Jan, 2022 - Comments: 0

The ability to trace the genealogy of all the components in an electronic device has been getting more complex for decades. For many industries — automotive, defense, medical and others — the need to locate the source of a problem in near real-time is paramount to gauging the extent of that problem. The extreme case is when the issue occurs with a product that already has been distributed a... » read more

Large-Field, Fine-Resolution Lithography Enables Next-Generation Panel-Level Packaging
By Onto Innovation - 11 Jan, 2022 - Comments: 0

The lithography challenge for large heterogeneous integration is the limited size of the exposure field (typically 60mm x 60mm or less) for most currently available lithography systems. Fine resolution and a large field size provide the user with the opportunity to increase the package size beyond 150mm x 150mm and maintain high throughput. This new capability has the potential to pave the ... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Speeding Up Scan-Based Volume Diagnosis
By Bryon Moyer - 07 Dec, 2021 - Comments: 0

In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

Deep Learning Delivers Fast, Accurate Solutions For Object Detection In The Automated Optical Inspection Of Electronic Assemblies
By Charlie Zhu - 07 Dec, 2021 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. However, some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. For example, shown an image containing a cat, a dog, and a duck, a human can insta... » read more

Streaming Scan Network: An Efficient Packetized Data Network For Testing Of Complex SoCs
By Siemens EDA - 07 Dec, 2021 - Comments: 0

Originally presented at the 2020 International Test Conference by Siemens and Intel authors, this paper describes the Tessent Streaming Scan Network technology and demonstrates how this packetized data network optimizes test time and implementation productivity for today’s complex SoCs. The author-submitted version of the IEEE paper is reprinted here with permission. Authors: Jean-Françoi... » read more

Optimizing System Performance At Runtime
By Tomer Morad - 07 Dec, 2021 - Comments: 0

Silicon lifecycle management (SLM) is one of the hottest emerging topics in the semiconductor industry. Chip and system developers face relentless demands for ever greater performance, reliability, functional safety, and security along with lower power consumption and silicon cost. Key applications driving these demands include data centers, autonomous vehicles, complex consumer devices such as... » read more

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