Chip Industry Technical Paper Roundup: Dec. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=501 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Research Bits: Dec. 8


Iron-on circuit Researchers from Virginia Tech developed iron-on electronic circuits that can be applied to clothing. The patch uses electrically conductive liquid metal and a heat-activated adhesive to bond to fabric when heated with a hot iron. “E-textiles and wearable electronics can enable diverse applications from health care and environmental monitoring to robotics and human-machine... » read more

Chip Industry Technical Paper Roundup: Dec. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=499 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review.   » read more

Research Bits: Dec. 2


Ionothermoelectric cooling Researchers from the University of Osaka, University of Tokyo, and Japan's National Institute of Advanced Industrial Science and Technology proposed an ionothermoelectric cooling strategy for chips that enhances cooling by driving the flow of ions through nanoscale channels. “We fabricated a nanosized pore in a semiconductor membrane and surrounded the nanopore ... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Research Bits: Nov. 26


Hydrogel NAND gate Researchers from McMaster University and the University of Pittsburgh created a functionally complete NAND gate in a soft material using only beams of visible light. The NAND logic operation was completed by shining three self-trapped light beams into a photoresponsive merocyanine-functionalized hydrogel that is capable of performing compute tasks in the material itself w... » read more

Chip Industry Technical Paper Roundup: Nov. 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=494 /] Find more semiconductor research papers here. » read more

Research Bits: Nov. 18


Rubbery CMOS Researchers at University of Illinois Urbana-Champaign, University of Houston, Ulsan National Institute of Science and Technology, Pusan National University, and Southeast University designed fully stretchable complementary integrated circuits composed of both elastic n-type and p-type transistors that provide the same functionality as conventional CMOS while retaining stable elec... » read more

Chip Industry Technical Paper Roundup: Nov. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=492 /] Find more semiconductor research papers here. » read more

Research Bits: Nov. 10


Post-doping plasma for DRAM capacitors Researchers from Ulsan National Institute of Science and Technology (UNIST), Pohang University of Science and Technology (POSTECH), and Seoul National University of Science and Technology developed a post-doping plasma (PDP) process to improve the performance of DRAM capacitors. Aluminum-doped titanium dioxide (Al-doped TiO2) is a promising material fo... » read more

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