Chip Industry Technical Paper Roundup: Dec. 16

Chiplet approach for quantum processors; BEV thermal management; photonic chip with 2D programmable waveguide; processor fuzzing; systematic litho patterning of an Al-based hybrid resist; quantum chemistry on quantum HW; fault detection; 2D semiconductors; LLM-generated HW logic design automation; AI for quantum computing.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Artificial intelligence for quantum computing NVIDIA, Oxford,
U. of Toronto, Quantum Motion, U. of Waterloo et al.
Chiplet technology for large-scale trapped-ion quantum processors U. of Innsbruck, Alpine Quantum Technologies, Fraunhofer Institute for Silicon Technology ISIT
Automated Enumeration of Reconfigurable Architectures for Thermal Management Systems in Battery Electric Vehicles UIUC, Ford Motor, Kyushu U.
Arbitrary control over multimode wave propagation for machine learning Boston U., UC Irvine, Yale
ReFuzz: Reusing Tests for Processor Fuzzing with Contextual Bandits Texas A&M,
TU Darmstadt
Molecular Layer Deposited Aluminum-Based Hybrid Resist for High-Resolution Nanolithography and Direct Ultra-High Aspect Ratio Pattern Transfer Stony Brook, UT Dallas, Brookhaven National Laboratory
From Promise to Practice: Benchmarking Quantum Chemistry on Quantum Hardware Rensselaer Polytechnic Institute, IBM T.J. Watson Research Center
Extending and Accelerating Inner Product Masking with Fault Detection via Instruction Set Extension KU Leuven, National University of Singapore, Rambus
High-κ dielectric van der Waals integration on 2D semiconductors for three-dimensional complementary logic systems Sungkyunkwan U., KAIST
Mitigating hallucinations and omissions in LLMs for invertible problems: An application to hardware logic design automation IBM Research

Find more semiconductor research papers here and in the most recent Chip Industry Week in Review.



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