CXL-enabled idle I/O bandwidth harvesting; tunnel FETs; adv. packaging thermal regulation; RRAM-based computing-in-memory; nanopore heat dissipation; deformable blend thin films of polymer semiconductors; data sharing in IC manufacturing; scalable fabrication of nano-OLEDs; DeepSeek’s new AI models; analog foundation models.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting | Georgia Tech |
| A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging | Sungkyunkwan Univ. |
| Special Session Paper: Formal Verification Techniques and Reliability Methods for RRAM-based Computing-in-Memory |
Univ. of Bremen, DFKI, Univ. of Florida, TU Munich |
| Gate-Tunable Ionothermoelectric Cooling in a Solid-State Nanopore | Univ. of Osaka, Univ. of Tokyo, AIST et al. |
| Next-generation tunnel FETs: Surpassing the Energy Efficiency of Conventional MOSFETs | Sandia National Laboratories |
| Polymer semiconductor blends with remarkably stable semiconducting performance under large and cyclic mechanical deformation | Chinese Academy of Sciences, RIKEN |
| Artificial Intelligence with Open and Scaled Data Sharing in Semiconductor Manufacturing – Workshop Report | NIST |
| Scalable nanopatterning of organic light-emitting diodes beyond the diffraction limit | ETH Zurich, Univ. of Alberta, IISc, Huazhong Univ. of Science and Technology |
| DeepSeek’s New AI Models | DeepSeek |
| Analog Foundation Models | IBM Research– Zurich, ETH Zurich, IBM Research-Almaden, IBM TJ Watson Research Center |
Find more semiconductor research papers here and in the most recent Chip Industry Week in Review.
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