category: Technical Papers

category: Auto, Security & Edge AI

Capability Hardware Enhanced RISC Instructions (CHERI) For Verification, With Better Memory Safety (Oxford)
By Technical Paper Link - 30 Nov, 2022 - Comments: 0

A technical paper titled "A Formal CHERI-C Semantics for Verification" was published by researchers at University of Oxford. Abstract: "CHERI-C extends the C programming language by adding hardware capabilities, ensuring a certain degree of memory safety while remaining efficient. Capabilities can also be employed for higher-level security measures, such as software compartmentalization, ... » read more

3D Structuring Inside GaAs by Ultrafast Laser Inscription
By Technical Paper Link - 28 Nov, 2022 - Comments: 0

A new technical paper titled "Burst mode enabled ultrafast laser inscription inside gallium arsenide" was published by researchers at LP3 Laboratory in France, a joint research unit of Aix-Marseille University (AMU) and CNRS. "We investigate the possibility of using THzrepetition-rate burst mode for ULI inside GaAs, a material that cannot be internally processed with single femtosecond pulse... » read more

Phononic and Magnonic Properties of 1D MoI3 Nanowires
By Technical Paper Link - 28 Nov, 2022 - Comments: 0

A new technical paper titled "Elemental excitations in MoI3 one-dimensional van der Waals nanowires" was published by researchers at NIST, UC Riverside, University of Georgia, Theiss Research Inc, and Stanford University. "We described here the elemental excitations in crystals of MoI3 a vdW [van der Waals] material with a true-1D crystal structure. Our measurements reveal anomalous temperat... » read more

Wafer-Scale Variability In Photonic Devices & Effects On Circuits
By Technical Paper Link - 25 Nov, 2022 - Comments: 0

A technical paper titled "Capturing the Effects of Spatial Process Variations in Silicon Photonic Circuits" was published by researchers at Photonics Research Group, Ghent University−IMEC. "We present in this paper a method to extract a granular map of the line width and thickness variation on a silicon photonics wafer. We propose a hierarchical model to separate the layout-dependent and l... » read more

EV Charging Cybersecurity Challenges (Sandia National Labs)
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A technical paper titled "Review of Electric Vehicle Charger Cybersecurity Vulnerabilities, Potential Impacts, and Defenses" was published by researchers at Sandia National Laboratories. Abstract: "Worldwide growth in electric vehicle use is prompting new installations of private and public electric vehicle supply equipment (EVSE). EVSE devices support the electrification of the transportat... » read more

X-Ray Device Alteration (XDA) Of Flip-Chip Packaged FinFET Devices
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "X-Ray Device Alteration Using a Scanning X-Ray Microscope" was published by researchers at NVIDIA and Sigray. "Near Infra-Red (NIR) techniques such as Laser Voltage Probing/Imaging (LVP/I), Dynamic Laser Stimulation (DLS), and Photon Emission Microscopy (PEM) are indispensable for Electrical Fault Isolation/Electrical Failure Analysis (EFI/EFA) of silicon Integr... » read more

Opportunities and Challenges for Carbon Nanotube Transistors
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical review paper titled "Carbon nanotube transistors: Making electronics from molecules" was published by researchers at Duke University, Northwestern University, and Stanford University. “Between the opportunities in high-performance digital logic with the potential for 3D integration and the possibilities for printed and even recyclable thin-film electronics, CNT transistors ... » read more

New Method For Determining How 2D Materials Expand (MIT)
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "A unified approach and descriptor for the thermal expansion of two-dimensional transition metal dichalcogenide monolayers" was published by researchers at MIT and Southern University of Science and Technology (China). "A new technique that accurately measures how atom-thin materials expand when heated could help engineers develop faster, more powerful electronic... » read more

New Material for Printing At the Nanoscale, Strong & Light (Stanford/Northwestern)
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "Mechanical nanolattices printed using nanocluster-based photoresists" was published by researchers at Stanford University and Northwestern University. The researchers have developed a new material for nanoscale 3D printing to be used for drones, microelectronics and satellites, demonstrating that "the new material is able to absorb twice as much energy than othe... » read more

State-Of-The-Art Architectures for Analog Low-Dropout Voltage Regulators
By Technical Paper Link - 23 Nov, 2022 - Comments: 0

A new technical paper titled "Evaluation and Perspective of Analog Low-Dropout Voltage Regulators: A Review" was published by researchers at Universiti Tunku Abdul Rahman, University of Malaya, Asia Pacific University of Technology and Innovation, and University of Macau. Abstract: "Low-dropout regulators (LDOs) are widely adopted in power management integrated circuits (PMICs) and serve as... » read more

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