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category: Auto, Security & Edge AI

Experts At The Table: Process Technology Challenges
By Mark LaPedus - 13 Sep, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

Experts At The Table: Next-Generation IP Landscape
By Ann Mutschler - 13 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss predictions about the next generation design IP landscape with Robert Aitken, R&D fellow at ARM; Laurent Moll, chief technical officer at Arteris; Susan Peterson, group director, product marketing for verification IP & memory models in the system & software realization group at Cadence; and John Koeter, vice preside... » read more

Power Optimization Requires Higher-Level Thinking
By Ann Mutschler - 12 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler With consumer demand—much of it for power sensitive mobile devices—driving the bulk of semiconductor design activity, it would seem obvious that the way chips are designed would have changed to reflect that. But have they? From an EDA perspective, the term ‘system level’ is used to mean ‘product level’ but this may not be enough, especially when it come... » read more

New Risk Factors For SoCs
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Third-party IP is becoming increasingly important in SoC designs. It saves development time and adds unique value. It also can improve performance and lower power, because a company specializing in IP frequently can build and optimize it better than a company that builds entire chips. But there are also plenty of landmines in IP integration, and there is a growing concern abo... » read more

Experts At The Table: Who Takes Responsibility?
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Semiconductor Engineering sat down with John Koeter, vice president of marketing and AEs for IP and systems at Synopsys; Mike Stellfox, technical leader of the verification solutions architecture team at Cadence; Laurent Moll, CTO at Arteris; Gino Skulick, vice president and general manager of the SDMS business unit at eSilicon; Mike Gianfagna, vice president of corporate market... » read more

Low-Power CPUs Hitting Their Stride In The Datacenter
By Ann Mutschler - 12 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler Without a doubt, the cloud has and continues to change the nature of the datacenter, particularly the requirements the infrastructure has to deliver. Diane Bryant, senior vice president and general manager of the Datacenter and Connected Systems Group at Intel, noted during a Webcast last week, “The infrastructure must change in support of cloud-based services.�... » read more

Power Optimization Requires Higher-Level Thinking
By Ann Mutschler - 12 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler With consumer demand—much of it for power sensitive mobile devices—driving the bulk of semiconductor design activity, it would seem obvious that the way chips are designed would have changed to reflect that. But have they? From an EDA perspective, the term ‘system level’ is used to mean ‘product level’ but this may not be enough, especially when it come... » read more

Power Grid Analysis Heats Up At 20nm
By Ann Mutschler - 12 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler Do a simple Internet search for the term ‘power grid analysis’ and most of the results are academic sources. However, given the physics of either planar or finFET at 20nm and below, the power grid will see significant impacts. Overall, there are a number of technical implications of migrating from 28nm down to 20, 16 or 14 nm, with further impacts of moving fro... » read more

Under One Roof
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Microsoft’s decision to buy Nokia’s phone business, Apple’s move to build its own chips to more effectively run its software, and Google’s effort to develop its own hardware for next-generation platforms such as Google Glass mark an interesting reversal in the electronics industry. Disaggregation was the answer to slow-moving giants such as big-iron companies. Startin... » read more

Experts At The Table: Process Technology Challenges
By Mark LaPedus - 05 Sep, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future transistor, process and manufacturing challenges with Subramani Kengeri, vice president of advanced technology architecture at GlobalFoundries; Carlos Mazure, chief technical officer at Soitec; Raj Jammy, senior vice president and general manager of the Semiconductor Group at Intermolecular; and Girish Dixit, v... » read more

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