Meeting Emerging Needs For Next-Generation 3D-IC And Sub-20nm Designs

Meeting performance, power and price goals requires new design approaches, including 3D stacked-die architectures.

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To remain competitive, IC designers must meet performance, power and price goals. However, these mutually conflicting goals require design techniques including 3D stacked-die architectures that will help meet performance and power targets by extending the integration capabilities beyond traditional SoC methodologies.

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