tag: EDA

AI Agent Orchestration For ASIC Autonomy
By Ed Sperling - 27 Jul, 2026 - Comments: 0

The use of AI agents in chip design has been limited to small portions of the design flow. Engineers have been proceeding cautiously to understand how agents work, how to ensure they are delivering consistent results, and how different agents work together. The next step is to extend their role beyond just gluing together coding and tooling functions. Mehir Arora, head of engineering at ChipAge... » read more

Preparing For AI-Driven Chip Design And Verification
By Ed Sperling - 27 Jul, 2026 - Comments: 0

Key Takeaways: Agentic AI will fundamentally change how engineers approach design and verification, and it will require them to adapt or be left behind. AI is a black box, so ensuring reliability will require external observability through sandboxing, along with other safeguards in case something does go wrong. The concentration of profitability in a few companies will shift as agent... » read more

AI In Chip Design: Lots Of Promise, Plenty Of Unanswered Questions
By Ed Sperling - 15 Jul, 2026 - Comments: 0

Key Takeaways: AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but questions persist about the impact of increasing reliance on what is essentially a black-box chip design. There is no consistent answer to how successful AI will be, where it will succeed or fail, or how it will apply to different markets and EDA customers.... » read more

EDA/SIP Revenue Up 12.7%; APAC Roars Back
By Ed Sperling - 13 Jul, 2026 - Comments: 1

Worldwide EDA, semiconductor IP, and services revenue reached $5.748 billion in Q1 2026, a 12.7% increase compared to the same period in 2025. The key driver continues to be demand for tools used to create AI server chips, with computer-aided engineering up 15.5% to $2.018 billion. There was a noticeable bump in Chinese sales due to a relaxation of export restrictions, rising 31% to $508 mil... » read more

Change Is Tough
By Brian Bailey - 13 Jul, 2026 - Comments: 1

When I was actively involved in the creation of standards for the EDA and semiconductor industry, it was often joked that the great thing about standards is that there are plenty to choose from. According to the Internet, this quote can either be attributed to Grace Murray Hopper (an incredible pioneer in the development of modern programming languages and a rear admiral in the Navy), or Andrew... » read more

The Architecture Decisions Behind A Production-Ready EDA AI Agent
By Emma-Jane Crozier - 09 Jul, 2026 - Comments: 0

The conversation about agentic AI in semiconductor and PCB design tends to focus on capability: what the agent can do, how much time it saves, and which parts of the workflow it can automate. That is a reasonable place to start, but that is not where the hard engineering happens. Organizations are now asking whether AI agents can take on meaningful portions of the workflow, not as assistants th... » read more

An AI Model Fit For Purpose
By Brian Bailey - 09 Jul, 2026 - Comments: 0

Key takeaways A model can only be used for its intended purpose, in a defined context, without taking unknown risks. Models must be created using a well-defined process and verified in a way that provides a level of independence. Deployment requires trust and a way to track the properties of the model. A model captures some kind of behavior exhibited in the real world, but a... » read more

Unifying Software And Semiconductor Development
By Siemens EDA - 08 Jul, 2026 - Comments: 0

In this white paper, we will discuss the emerging trend in which hardware is increasingly designed to meet the end functionality of today’s systems, which is largely defined in software. This emerging software-defined era of electronic system design requires new methodologies in which the IC and PCB design is performed in concert with software design. In this paper, we will also look closely ... » read more

LLM Agents To Refactor Software For High Level Synthesis (Carnegie Mellon, UCLA)
By Technical Paper Link - 03 Jul, 2026 - Comments: 0

Researchers from Carnegie Mellon University and UCLA published a technical paper titled “AgRefactor: Self-Evolving Agentic Workflow for HLS Compatibility and Performance.” The paper introduces an “LLM-based multi-agent workflow  for refactoring software into HLS-compatible programs" and reports a 6.51× geometric mean speedup over a state-of-the-art pragma tuning tool. Find the tec... » read more

Executive Outlook: Agentic AI’s Impact On Chip Design
By Ed Sperling - 25 Jun, 2026 - Comments: 1

Key Takeaways: Agentic AI has the potential to make engineers more productive, speed time to market, and automate some of the drudge work. The big challenge for design and verification engineers is where and whether they trust AI to get everything right, because there is no margin for error in semiconductors. Having humans in the loop will likely be the rule rather than the exception... » read more

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