tag: EDA

ATE Lab To Fab
By Ed Sperling - 05 Jun, 2019 - Comments: 2

Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

DAC 2019: Day 1
By Brian Bailey - 04 Jun, 2019 - Comments: 2

The last time that DAC was in Las Vegas was 2001. Much has changed since then. The first day kicked off with the usual ceremonies and then two short keynotes. A change from previous years is that keynotes are now on the show floor. This is presumably to ensure that once the keynotes are over, everyone sees the vendor booths. During the commencement session, it was also announced that all cof... » read more

CEO Outlook: It Gets Much Harder From Here
By Ed Sperling - 03 Jun, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing across the semiconductor industry with Wally Rhines, CEO emeritus at Mentor, a Siemens Business; Jack Harding, president and CEO of eSilicon; John Kibarian, president and CEO of PDF Solutions; and John Chong, vice president of product and business development for Kionix. What follows are excerpts of that discussion, which was held in... » read more

Moore Open Source Coming
By Brian Bailey - 30 May, 2019 - Comments: 0

The sunsetting of Moore's Law is creating some interesting ripples throughout the EDA and IP industries. No longer is the low-risk path defined by a migration to the next node. Most companies cannot afford it and don’t need it. Neither can their competitors. Suddenly, they have to do more with less, or at least the same amount. Consider just a few things that are changing today: Stick... » read more

Extending RISC-V ISA With Custom Instruction Set Extension
By Codasip - 29 May, 2019 - Comments: 0

RISC-V ISA (Instruction Set Architecture) is designed in a modular way. It means that the ISA has several groups of instructions (ISA extensions) that can be enabled or disabled as needed. This allows implementing precisely the instruction groups that the application needs, without having to pay for area or power that will not be used. One of the groups is special; it has no predefined instruct... » read more

The Changing Landscape of Hardware-Based Verification And Software Development
By Frank Schirrmeister - 24 May, 2019 - Comments: 0

As the EDA is gearing up for its biggest industry event, the Design Automation Conference (DAC), this year in Las Vegas, it is interesting to observe what is going on in hardware-based development of emulation and prototyping. The trends I had outlined after last DAC in 2018—system design, cloud, and machine learning—have only grown stronger and are causing changes in the development landsc... » read more

Automotive System Design
By Ed Sperling - 06 May, 2019 - Comments: 0

Burkhard Huhnke, vice president of automotive at Synopsys, looks at how to build and update chips in increasingly sophisticated vehicles, where the problem spots are, and what comes next. » read more

IP Requires System Context At 6/5/3nm
By Ann Mutschler - 01 May, 2019 - Comments: 0

Driven by each successive generation of semiconductor manufacturing technology, complexity has reached dizzying levels. Every part of the design, verification and manufacturing is more complicated and intense the more transistors are able to be packed onto a die. For these reasons, the entire system must be taken into consideration as a whole – not just as individual building blocks as could ... » read more

Challenges In Using HLS For FPGA Design
By Loren Hobbs - 29 Apr, 2019 - Comments: 0

High-level synthesis (HLS) tools, which transform C/C++ source code to Verilog/VHDL, have been commercially available for over 15 years. HLS tools from FPGA vendors and EDA companies promise improved productivity through a higher-level of abstraction, faster verification and quicker design iterations. For example, simulating your design in C/C++ can be 10 to 100x faster than simulating in RTL (... » read more

Focus Shifting From 2.5D To Fan-Outs For Lower Cost
By Ed Sperling - 29 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

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