Will 2026 Be Dominated By AI?


Many opportunities and problems became highly interlinked in 2025, fueled by the historic growth in everything AI. But how close are we coming to breaking points, and what are people doing to mitigate them? That is the story that will unfold this year. AI's penetration into an increasing number of workloads is placing almost quadratic demands on compute, memory, interconnect, and the archite... » read more

Chip Industry Week In Review


Breaking news: Nvidia and Synopsys announced a multi-faceted, multi-year deal that includes everything from digital twins to CUDA programming, engineering, and marketing collaboration, and Nvidia's $2B purchase of Synopsys stock. [Updated 12/1] Memory news: Micron is building a $9.6B HBM facility in the city of Higashi-Hiroshima Japan, reports Nikkei. China's ChangXin Memory Technol... » read more

Chip Industry Week In Review


Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

2025: So Many Possibilities


The stage is set for a year of innovation in the chip industry, unlike anything seen for decades, but what makes this period of advancement truly unique is the need to focus on physics and real design skills. Planar scaling of SoCs enabled design and verification tools and methodologies to mature on a relatively linear path, but the last few years have created an environment for more radical... » read more

3D Connection Artifacts In PDN Measurements


Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

Getting Rid Of Heat In Chips


Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

Challenges With Adaptive Control


Historically, the performance and power consumption of a system was controlled by what could be done at design time, but chips today are becoming a lot more adaptive. This has become a necessity for cutting edge nodes, but also provides a lot of additional benefits at the expense of greater complexity and verification challenges. Design margins are a tradeoff between performance and yield. C... » read more

Taking Power Much More Seriously


An increasing number of electronic systems are becoming limited by thermal issues, and the only way to solve them is by elevating energy consumption to a primary design concern rather than a last-minute optimization technique. The optimization of any system involves a complex balance of static and dynamic techniques. The goal is to achieve maximum functionality and performance in the smalles... » read more

Week In Review: Design, Low Power


Ansys will acquire cloud simulation provider OnScale. OnScale's technology will be used to provide a cloud-native, web-based UI for device-independent access to Ansys’ simulation technologies as well as creation of simulation-based vertical applications. “OnScale’s cloud-native technology combines the limitless compute power of cloud supercomputers with an intuitive web-based front end, m... » read more

Week In Review: Design, Low Power


Tools Vtool released a new version of its Cogita visual debug platform. New features aim to provide faster debug capabilities, including visual representation of test results using log files as input, improved manipulation and navigation throughout big logs, ML algorithms to classify data and find the relationship between inputs, and the ability to merge and compare test flow of two different ... » read more

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