Blog Review: March 23


Arm's Ilias Vougioukas presents new ways to improve on virtual to physical memory translation without breaking any of the pre-existing hardware or software. Siemens' Scot Morrison considers the current regulatory landscape for security of medical devices, including how device manufactures need to proactively implement a plan to find, assess, and respond to potential vulnerabilities. Synop... » read more

CXL and OMI: Competing or Complementary?


System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications


By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

What Else Can You Do While Driving A Car?


Increasing levels of autonomy in vehicles are driving increased demands for new technology. Consumers care about the electronics in their vehicles, for both safety and convenience, and those features are impacting both purchase decisions and new vehicle designs. As vehicles grow in sophistication with advanced driver assistance, electrification, or alternative fuel sources, personalized vehi... » read more

Blog Review: March 16


Ansys' Peter Hallschmid and Sandra Gely look at why, compared to rain and fog, snow is a different challenging environment for automotive sensors and how the random pattern of snowfall, properties of each flake, and the various distance between flakes play havoc on detecting objects. Siemens' Chuck Battikha focuses on how to protect against random hardware faults, the added costs of includin... » read more

Week In Review: Design, Low Power


Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing, IoT, 5G and beyond Keysight Technologies received a U.S. Federal Communications Commission (FCC) Spectrum Horizons Experimental License to develop 6G technology in sub-terahertz, between 95 gigahertz (GHz) and 3 THz. "Innovations in sub-THz spectrum will support use-cases such as immersive telepresence, digital twins and extended reality, which is all real-and-virtual comb... » read more

Power Now First-Order Concern In More Markets


Concerns about energy and power efficiency are becoming as important as performance in markets where traditionally there has been a significant gap, setting the stage for significant shifts in both chip architectures and in how those ICs are designed in the first place. This shift can be seen in a growing number of applications and vertical segments. It includes mobile devices, where batteri... » read more

Constraints On The Electricity Grid


I recently wrote about Moss Landing, the biggest grid battery storage operation in the world. I discovered from talking to a friend recently that most people have no idea what constraints the electricity grid operates under. I think most politicians are the same, and they assume that if we build enough windmills and solar panels then we can live in some sort of eco-nirvana. But that's not goin... » read more

Blog Review: March 9


Arm's Ajay Joshi investigates how to select the right benchmark for CPUs used in the Home device market, such as digital television and set-top box/over-the-top devices. Ansys' Jon Kordell checks out how reliability physics simulations and physical component characterization can support component swapping in high-reliability applications when the original part is unavailable due to supply ch... » read more

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