tag: DSP

Running Out Of Energy?
By Ann Mutschler - 16 Mar, 2016 - Comments: 1

The anticipated and growing energy requirements for future computing needs will hit a wall in the next 24 years if the current trajectory is correct. At that point, the world will not produce enough energy for all of the devices that are expected to be drawing power. A report issued by the Semiconductor Industry Association and Semiconductor Research Corp., bases its conclusions on system-le... » read more

How Many Cores? (Part 1)
By Ed Sperling - 10 Mar, 2016 - Comments: 2

The optimal number of processor cores in chip designs is becoming less obvious, in part due to new design and architectural options that make it harder to draw clear comparisons, and in part because just throwing more cores at a problem does not guarantee better performance. This is hardly a new problem, but it does have a sizable list of new permutations and variables—right-sized heteroge... » read more

How To Choose A Processor
By Ann Mutschler - 10 Dec, 2015 - Comments: 0

Choosing a processor might seem straightforward at first glance, but like many engineering challenges it's harder than it looks. When is a CPU better than a GPU, MCU, DSP or other type of processor? And for what design—or part of a design? For decades, the CPU has been the default choice. “It is deliberately designed to be pretty efficient at all tasks, is straightforward to program, ... » read more

The Week In Review: Design/IoT
By Jesse Allen - 09 Oct, 2015 - Comments: 0

Imec and Cadence completed the first tapeout of a 5nm test chip. Using a processor design, the companies taped out a set of designs using EUV lithography as well as Self-Aligned Quadruple Patterning for 193i lithography, where metal pitches were scaled from the nominal 32nm pitch down to 24nm to push the limit of patterning. Tools Synopsys folded in recent acquisition Atrenta's testabilit... » read more

Appetite For Services Grows
By Ed Sperling - 11 Sep, 2015 - Comments: 0

Semiconductor service revenues have been growing for the past year, fueled by complex thermal and power issues at advanced nodes, the difficulty of integrating more and more IP blocks, and far more techniques, languages and methodologies that engineers need to learn to be productive in the finFET generation. The services business typically acts as a bridge between down and up cycles in the c... » read more

New Metrics For The Cloud
By Ed Sperling - 10 Sep, 2015 - Comments: 0

Data centers are beginning to adjust their definition of what makes one server better than another. Rather than comparing benchmarked performance of general-purpose servers, they are adding a new level of granularity based upon what kind of chips work best for certain operations or applications. Those decisions increasingly include everything from the level of redundancy in compute operations, ... » read more

Using Automotive-Ready IP To Accelerate SoC Development
By Ron DiGiuseppe - 13 Aug, 2015 - Comments: 0

IP suppliers play a key role in the automotive supply chain to enable high-performance advanced driver assistance system (ADAS) SoCs. Vision-based SoCs may contain a high amount of third-party IP to implement the key embedded vision, sensor fusion, multimedia, security and advanced connectivity functions. And while IP suppliers have permeated the semiconductor ecosystem for consumer, mobile, PC... » read more

Looking For The Next Big Thing
By Brian Bailey - 21 Aug, 2014 - Comments: 0

With [getkc id="74" comment="Moore's Law"] slowing down or coming to an end, finding the next big thing may be very different than it was in the past. We cannot assume that more of the same will be a winner. The semiconductor industry has been blessed with two new product categories that have catapulted it through what should have been a very difficult period with barely a scratch. Those techno... » read more

Ultra Low Power Integrated Platform For Connectivity And Audio/Voice/Sensing
By Various Writers - 07 May, 2014 - Comments: 0

A look at an integrated approach on a single DSP and why it's needed. To download this white paper, click here. » read more

DSP-Based Testing
By Various Writers - 16 Apr, 2014 - Comments: 0

ADC and DAC are the most typical mixed signal devices. In mixed signal testing, analog stimulus signal for an ADC is generated by an arbitrary waveform generator (AWG) which employs a D/A converter inside, and an analog signal out of a DAC is measured by a digitizer or a sampler which employs an A/D converter inside. The stimulus signals for these devices are created using mathematical method, ... » read more

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