tag: finFETs

FD-SOI Meets The IoT
By Ann Mutschler - 05 Feb, 2015 - Comments: 1

Silicon-on-insulator manufacturing technology has been discussed for many years. IBM has used the partially depleted variation of SOI in its server products, but the fully depleted version has yet to find widespread adoption outside of mil/aero and automotive markets. That may change soon as applications in the Internet of Things ramp, given the requirements for ultra low power and low cost.... » read more

Next Channel Materials?
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

Chipmakers are making a giant leap from planar transistors to [getkc id="185" kc_name="finFETs"]. Initially, [getentity id="22846" e_name="Intel"] moved into finFET production at 22nm and is now ramping up its second-generation finFETs at 14nm. And the other foundries will enter the finFET fray at 16nm/14nm. So what’s next? Chipmakers will likely extend the finFET architecture to both 10nm... » read more

Manufacturing And Packaging Changes For 2015
By Brian Bailey - 22 Jan, 2015 - Comments: 0

This year more than 26 people provided predictions for 2015. Most of these came from the EDA industry, so the results may be rather biased. However, ecosystems are coming closer together in many parts of the semiconductor food chain, meaning that the EDA companies often can see what is happening in dependent industries and in the system design houses. Thus their predictions may have already res... » read more

Fab Tool R&D And Ramen Noodles
By Mark LaPedus - 22 Jan, 2015 - Comments: 0

The semiconductor equipment and materials industry has always been a tough business. Over the years, vendors have been under pressure to develop new technologies for a shrinking but demanding customer base. And as a result, many vendors could not keep up, or elected to exit the business, causing a massive shakeout in the industry. It isn’t getting any easier, though. Today, tool and... » read more

Signal Integrity Issues
By Ed Sperling - 21 Jan, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss signal integrity with Rob Aitken, research fellow at [getentity id="22186" comment="ARM"]; PV Srinivas, senior director of engineering for the Place & Route Division of [getentity id="22017" e_name="Mentor Graphics"]; and Bernard Murphy, chief technology officer at [getentity id="22026" e_name="Atrenta"]. What follows are excerpts of that conver... » read more

Tech Talk: Set-Top Power
By Ed Sperling - 19 Jan, 2015 - Comments: 0

Broadcom's John Redmond, associate technical director for digital video technology, talks with Semiconductor Engineering about what the next-generation set-top boxes will look like and how they will save power. The video was shot at Cadence's Low Power Summit. [youtube vid=Ov2GFrUTzts] » read more

IP Design Essentials For Reliability And SoC Integration
By Annapoorna Krishnaswamy - 15 Jan, 2015 - Comments: 0

IP is integral to every SoC design. The need for ubiquitous connectivity has pushed the threshold for content in SoCs even beyond the tenets of Moore’s Law. Technology scaling has not only enabled the delivery of increased performance and reduced power, but also rich content through the integration of a wide range of IPs such as radio devices, CMOS image sensors, MEMs, etc., into a single ... » read more

(Low) Power Predictions 2015
By Anand Iyer - 15 Jan, 2015 - Comments: 1

Happy New Year! As we step into the New Year, lots of exciting things are already underway. First of all, the Internet of Things (IoT) is shaping up in a big way as witnessed at CES last week. Advances in devices that can talk to each other and share information are becoming a reality. Automotive applications, medical devices, industry automation, energy distribution and entertainment are all a... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Ansys - 14 Jan, 2015 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially finFET-based devices. These advanced technology nodes allow chips to operate... » read more

Industry Scorecard For 2014
By Brian Bailey - 18 Dec, 2014 - Comments: 0

At the end of last year, Semiconductor Engineering asked the industry about the developments they expected to see in 2014. If you care to refresh your memory, they were categorized under markets, semiconductors and development tools. Now it is time to look back and see how accurate those predictions were and where they fell short. Markets The obvious trend, at the beginning of the year, wa... » read more

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