Chip Industry Week In Review


Manufacturing ASE and WUS are jointly building a ~$1.1B advanced packaging hub in Kaohsiung, Taiwan, for fan-out chip-on-substrate (FOCoS) and flip-chip ball grid array (FC BGA) technologies. The new site is expected to be completed by September 2029. SpaceX filed documents for a “Terafab” semiconductor manufacturing and computing facility at Gibbons Creek Reservoir in Texas, with a... » read more

Blog Review: May 6


Synopsys' Prith Banerjee identifies key challenges in designing AI data centers and why addressing them requires a transformative approach that impacts every aspect of the system design and its individual components. Cadence's Meet S Chauhan checks out what's new in MIPI C-PHY v3.0, including the new 18 wire state mode that can support high-resolution display and image sensors and motion vec... » read more

Foundry Capacity Is Limiting Who Competes At Leading Edge Nodes


Key Takeaways: Leading-edge node access is increasingly reserved for hyperscalers, squeezing smaller chip developers. Chiplets and advanced packaging offer a path forward, but raise cost, complexity, and risk — especially for smaller teams. Chip architecture is now driven as much by capacity, yield, and economics as by technical goals. The benefits of device scaling are sl... » read more

Chip Industry Week In Review


Deals Marvell acquired Polariton Technologies, a Swiss developer of plasmonics-based silicon photonics devices. Onto Innovation is partnering with Rigaku, combining Onto’s analysis software with Rigaku’s CD-SAXS platform for advanced semiconductor process control. Onto also agreed to acquire a 27% stake in Rigaku for about $710M. Tesla plans to use Intel’s 14A process for its T... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Breakthrough Thin GaN Chiplet Technology


Researchers at Intel Foundry have demonstrated a gallium nitride (GaN) chiplet technology built on 300 mm GaN-on-silicon wafers, marking a significant leap forward in semiconductor design. Presented at the 2025 IEEE International Electron Devices Meeting (IEDM), this work tackles one of the most pressing challenges in modern computing: how to deliver more power, speed, and efficiency in an incr... » read more

Blog Review: Apr. 15


Cadence's Wilson Kobalkar shares why eUSB2‑V2 represents a major evolutionary step for the USB 2.0 ecosystem, including how it achieves multi‑gigabit HSx operation and why symmetric/asymmetric modes unlock new design possibilities. Synopsys' Akanksha Soni explains the difference between metal-oxide-metal, metal-insulator-metal, and metal-oxide-semiconductor capacitors, identifying the ad... » read more

Chip Industry Week In Review


Deals, Funding Intel will join Elon Musk’s Terafab chip manufacturing project alongside Tesla, SpaceX, and xAI. Intel described its role as helping refactor silicon fab technology for a project targeting production of 1 TW/year of compute for AI and robotics applications. Intel and Google are expanding a multi-year collaboration on AI and cloud infrastructure, with Intel Xeon processo... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Challenges In Scaling Chips To 2nm And Below


Key Takeaways Scaling to 2nm and below continues due to power improvements per watt, but progress is much more challenging and costly. Solutions to problems often create other problems due to less margin for tradeoffs, often requiring larger interposers, more chiplets, and more complex packages. New levels of precision are required throughout the design-through-manufacturing flow, re... » read more

← Older posts Newer posts →