Moore Open Source Coming


The sunsetting of Moore's Law is creating some interesting ripples throughout the EDA and IP industries. No longer is the low-risk path defined by a migration to the next node. Most companies cannot afford it and don’t need it. Neither can their competitors. Suddenly, they have to do more with less, or at least the same amount. Consider just a few things that are changing today: Stick... » read more

Thermal Damage To Chips Widens


Heat is becoming a much bigger problem for semiconductor and system design, fueled by higher density and the increasing use of complex chips in markets such as automotive, where reliability is measured in decade-long increments. In the past, heat typically was handled by mechanical engineers, who figured out where to put heat sinks, fans, or holes to funnel heat out of a chassis. But as more... » read more