Mask Maker Worries Grow


Photomasks are becoming more complex and expensive at each node, thereby creating a number of challenges on several fronts. For one thing, the features on the [getkc id="265" kc_name="photomask"] are becoming smaller and more complex at each node. Second, the number of masks per mask-set are increasing as a result of multiple patterning. Third, it costs more to build and equip a new mask fab... » read more

Deploying Multi-Beam Mask Writers


Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss the company’s deal with Intel, photomasks, multi-beam mask writer technology and other topics. What follows are excerpts of that conversation. SE: This has been a significant year for IMS for two reasons. First, Intel recently announced plans to acquire IMS. Second, at the recent ... » read more

Defect Evolution In Next-Generation Extreme Ultraviolet Lithography


Extreme ultraviolet (EUV) lithography is a promising next generation lithography technology that may succeed optical lithography at future technology nodes. EUV mask infrastructure and manufacturing of defect-free EUV mask blanks is a key near term challenge in the use of EUV lithography. Virtual fabrication is a computerized technique to perform predictive, three dimensional modeling of sem... » read more

Good Filters, Poor Resists


Shrinking feature sizes and more complex lithography schemes are increasing the pressure on all aspects of the lithography process, including resists and resist filtration. As Clint Haris, vice president and general manager for liquid micro contamination control at Entegris explained, fabs are pushing resist manufacturers toward more stringent control of both contaminants and “soft particl... » read more

Manufacturing Bits: Sept. 13


Direct-write liquid litho The Department of Energy’s Oak Ridge National Laboratory has developed what could be called direct-write liquid lithography. In the lab, researchers have modified a scanning transmission electron microscope (STEM). Then, using the STEM as an e-beam tool, researchers have devised a technology that enables the direct write of tiny features in “microfabricated liq... » read more

Executive Insight: Aart de Geus


Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to discuss Moore's Law, the IoT, inflection points and how chip design will evolve in coming years. SE: We are in the middle of possibly one of the biggest transition points we’ve ever seen in this industry. How do you envision things shaking out? De Geus: There is no question that there is an enormou... » read more

Introduction To Multi-Patterning


Multi-patterning enables accurate lithographic resolution at today's most advanced nodes. Learn about the basics of this technology, and how it impacts your IC design and verification tasks and responsibilities. To read more, click here. » read more

IMEC Partner Technical Week Review


In March 2016, Coventor was invited to the biannual Partner Technical Week (PTW) at IMEC in Leuven, Belgium. IMEC, a world-leading research group in nanotechnology, organizes their Partner Technical Week every six months to present scientific results to their partners. During this week, a number of specialists from IMEC's many partner companies also discuss their progress in areas related to IM... » read more

Executive Insight: Aki Fujimura


Aki Fujimura, chief executive of D2S, sat down with Semiconductor Engineering to look at the key issues in lithography and photomasks, as well as the changes taking place in the IC industry. What follows are excerpts of that conversation. SE: The semiconductor market is changing on several fronts. On one front, there is a wave of consolidation in the industry. And then there is a slowdown in... » read more

Manufacturing Bits: June 21


Atomic sculpting Oak Ridge National Laboratory has combined a scanning transmission electron microscope (STEM) with new electronic controls. This tool enables the construction, or the atomic sculpting, of 3D-like feature sizes down to 1nm and 2nm. To achieve these dimensions, the STEM is controlled with a special set of programmable electronics. This, in turn, enables the STEM to tunnel in... » read more

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