Why The Next Couple Process Nodes Are So Critical


In the greater scheme of things, one process node doesn't matter all that much. In fact, it has become common practice for big chipmakers to skip nodes for some of their chips as power issues becoming increasingly complex, time-to-market windows shrink and leapfrogging is viewed as a way to maximize resources while remaining über-competitive. But the next process node, and certainly the nex... » read more

Self-Aligned Double Patterning—Part Deux


In my last article, I introduced you to the basic Self-Aligned Double-Patterning (SADP) process that is one of the potential candidate techniques for processing metal layers at 10nm and below, but let’s have a quick recap. SADP uses a deposition and etch step process to create spacers surrounding a patterned shape (Figure 1). As you can see, there are two masking steps—the first mask is cal... » read more

EUV Is Key To 450mm Wafers


Whether the wafers in question are 200 mm in diameter, or 300 mm, or potentially 450 mm, larger wafer sizes have always been justified by manufacturing economics. If the cost to process a wafer stays the same, but the wafer contains more devices, then the cost per device goes down. For processes that apply to the entire wafer at once — etch, deposition, cleaning, and so forth — the equation... » read more

EUV Light Source Makes Progress


EUV Lithography light source maker, Gigaphoton has developed a laser-produced plasma (LPP) light source prototype model that can produce a maximum of 92 watts. This is more than double the 43 watts produced using a traditional LPP light source. Figure 1 conceptual diagram of EUV exposure. Source: Gigaphoton/EUVA The biggest issue with EUV lithography has been the output power of the lig... » read more

IP Integration Challenges Rising


It’s not just [getkc id="80" comment="lithography"] that is putting a crimp in sub-28nm designs. As more functions, features, transistors and software are added onto chips, the pressure to get chips out the door has forced chipmakers to lean more heavily on third-party IP providers. Results, as you might expect, have been mixed. The number of blocks has mushroomed, creating its own web of ... » read more

How Much Multipatterning?


The latest consensus among litho experts is that extreme ultraviolet (EUV) will appear in the market sometime in coming months in a commercially viable form. The only question is the degree of commercially viability, and what it will actually cost. While some debate lingers about whether EUV will ever get going, the general feeling is that enough progress has been made recently to make it work.... » read more

Manufacturing Bits: June 3


World’s thinnest TFTs The U.S. Department of Energy’s Argonne National Laboratory has devised the world’s thinnest flexible, 2D thin-film transistors (TFTs). The transistors are just 10 atomic layers thick. TFTs are typically used in screens and displays. In the lab, Argonne researchers fabricated the TFTs on both a conventional silicon platform and a flexible substrate. [caption i... » read more

EDA Races To 7nm, Despite Litho Uncertainties


It’s becoming almost painful to refer to the delay with EUV, but it certainly isn’t stopping anyone on the design side from tweaking design tools or working on test chips. Clearly, things are moving ahead to 7nm even though lithography plans aren't yet clear. Steve Carlson, group marketing director in Cadence’s Office of Chief Strategy, said with regard to EUV, “They have the power p... » read more

Self-Aligned Double Patterning, Part One


I’m sure most of you have seen a Rorschach test ink blot (Figure 1). Psychiatrists ask the subjects to tell them what they “see” in the ink blot. The answers are used to characterize the respondent’s personality and emotional functioning. I am never sure if I would feel more uncertain being the psychiatrist asking the question, or the subject trying to decide what to say, given there ar... » read more

One-On-One: Linyong Pang


Semiconductor Engineering sat down to discuss trends in the lithography and photomask business with Linyong “Leo” Pang, the new chief product officer and executive vice president at D2S, which focuses on model-based mask data preparation as well as other mask writing technologies. What follows are excerpts of that conversation. SE: Before you arrived at D2S you were at Luminescent, whic... » read more

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