tag: Mentor

Addressing The Productivity Gaps In IIoT
By Scot Morrison - 05 Apr, 2018 - Comments: 0

The Industrial Internet of Things (IIoT) can be enabled by many different topologies and permutations of underlying infrastructure, but the one constant is that it brings new levels of profitability, efficiency, and productivity to businesses and industries near and far. The IIoT is enabled by connectivity from device to device, and device to and from the cloud. However, it’s not only abou... » read more

Where Is Energy Harvesting?
By Kevin Fogarty - 05 Apr, 2018 - Comments: 0

With power management a top priority in sensor networks, why is energy harvesting—a proven technology with diverse energy sources—conspicuously absent from sensor designs that are the foundation of the Internet of Things? [getkc id="165" kc_name="Energy harvesting"] always has been a promising answer to the limits of battery power. The idea that a device can run for much longer periods o... » read more

New Market Drivers
By Brian Bailey - 05 Apr, 2018 - Comments: 2

Semiconductor Engineering sat down to discuss changing market dynamics with Steve Mensor, vice president of marketing for [getentity id="22926" e_name="Achronix"]; Apurva Kalia, vice president of R&D in the System and Verification group of [getentity id="22032" e_name="Cadence"]; Mohamed Kassem, CTO for [getentity id="22910" comment="efabless"]; Matthew Ballance, product engineer and techno... » read more

Preparing For An IoT Edge Project
By Mentor, a Siemens Business - 04 Apr, 2018 - Comments: 0

Before starting your IoT edge device development process, it is wise to spend time preparing for your new project. Planning before you start will limit frustration and save you time and money in the long run. Before diving into the task, study the 15 preparation considerations in this white paper. To read more, click here. » read more

Mesh Networking Grows For ICs
By Kevin Fogarty - 04 Apr, 2018 - Comments: 0

Mesh networks were invented to create rich interaction among groups of almost-unrelated peers, but now they are showing up in everything from advanced chip packages to IoT networks. The flexibility of a many-to-many peer-connection model made the mesh approach a favorite for two-dimensional network-on-a-chip topologies, to the point where they began to supplant data-bus connections during th... » read more

Blog Review: April 4
By Jesse Allen - 04 Apr, 2018 - Comments: 0

Synopsys' Richard Solomon explains PCIe's upstream and downstream component naming and why understanding the perspective is key. Mentor's Cristian Filip dives into frequency domain analysis for high data rate SerDes links and the movement toward a simpler way of channel characterization. Cadence's Paul McLellan takes a look at the history of the RISC processors and the death of microcode ... » read more

How To Choose The Right Memory
By Ann Mutschler - 02 Apr, 2018 - Comments: 0

When it comes to designing memory, there is no such thing as one size fits all. And given the long list of memory types and usage scenarios, system architects must be absolutely clear on the system requirements for their application. A first decision is whether or not to put the memory on the logic die as part of the SoC, or keep it as off-chip memory. "The tradeoff between latency and th... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Mar, 2018 - Comments: 0

Chipmakers 3D NAND continues to gain steam, but is the industry headed towards a capacity glut in the overall NAND market? Time will tell. In any case, Toshiba is moving forward with its plans to invest in its Fab 6 facility in Japan. The fab will produce the company’s 96-layer 3D NAND devices. Then, Samsung plans to invest $7 billion to double the production capacity for NAND flash memor... » read more

The Week In Review: Design
By Jesse Allen - 30 Mar, 2018 - Comments: 0

Market research firm IC Insights says fabless IC suppliers accounted for 27% of the world’s IC sales in 2017—an increase from 18% ten years earlier in 2007. U.S. companies accounted for the greatest share of fabless IC sales last year at 53% (down, however, from 2010's share of 69%). Since 2010, the largest fabless IC marketshare increase has come from the Chinese suppliers, which captured ... » read more

Blog Review: March 28
By Jesse Allen - 28 Mar, 2018 - Comments: 0

Mentor's Joe Hupcey III and Jin Hou explain how to use the Open Verification Language (OVL) library of assertions to build an effective formal testbench. In a video, Cadence's Marc Greenberg discusses the benefits of moving non-volatile memory from the SSD to the DDR bus and possible new storage-class memories. Synopsys' Anders Nordstrom argues that security can no longer be ignored when ... » read more

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